Abstract: Method and system for forming a plurality of cadmium-sulfide layers. The method includes preparing a first solution and a second solution. The method further includes loading at least the first solution and the second solution into a pyrolysis-deposition system and placing a target structure into the pyrolysis-depositions system. The method further includes spraying the first solution through one or more first nozzles towards the target structure, forming, from the sprayed first solution, the first cadmium-sulfide layer, directly or indirectly, on the target structure, spraying the second solution through one or more second nozzles towards the target structure with at least the first cadmium-sulfide layer, and forming, from the sprayed second solution, the second cadmium-sulfide layer directly or indirectly, on the target structure.

Abstract: Method and system for forming a cadmium-sulfide layer on a substrate. The method includes preparing a solution and loading the solution into a pyrolysis-deposition system. The solution uses at least one cadmium-containing solute, at least one sulfur-containing solute, water, and at least one selected material. The pyrolysis-deposition system includes one or more nozzles and one or more heating devices. The method further includes placing a substrate into the pyrolysis-deposition system, adjusting a distance between the substrate and the one or more nozzles, heating the substrate with the one or more heating devices, and spraying the solution including the selected material towards the substrate. The selected material satisfies at least one property selected from a group consisting of the selected material being non-polar, the selected material having at least higher volatility than water, and the selected material having at least lower heat capacity than water.

Abstract: Embodiments of the invention provide a method for conditioning contacts of an electrochemical metal plating system. The method includes deplating the contacts by supplying a reversed biased energy and monitoring electrical measurements of the plating system in real-time such that the endpoint of a deplating process can be determined. In different embodiments, the method includes the use of a constant current or voltage, variable current or voltage, or combinations thereof for conditioning the contacts.

Abstract: Embodiments of the invention provide a method and formulations for preventing foam formation inside a plating apparatus prior to or during plating a material on a substrate. In one embodiment, a method for preventing foam formation inside a plating apparatus designed for plating a material on a substrate includes providing an electrolyte solution containing at least one antifoaming agent, at least one metal ion source, and a supporting electrolyte. The method further includes placing the substrate onto a substrate holder of the plating apparatus, immersing the substrate in the electrolyte solution, and depositing the material onto the substrate.

Abstract: A method and apparatus for removing degraded organics from an electroplating solution by passing at least a portion of electroplating solution through a filter. The apparatus generally includes a deposition cell including a fluid inlet, a fluid reservoir, and at least one filter disposed between the reservoir and the fluid inlet. The apparatus may further include a control valve disposed between the fluid reservoir and the fluid inlet for passing at least a portion of an electroplating solution to a recovery stream including the at least one filter.

Abstract: A coating layer is applied to a semiconductor device fabrication equipment, specifically, to a sidesurface of an inventive target. Characteristics of the coating layer promote adhesion of sputtered particles which may accumulate on the deposition equipment surface. The coating layer therefore reduces the probability that sputtered particles will flake or crumble from the equipment and contaminate a substrate being processed therein.

Abstract: A sealing surface of a sputter deposition chamber is provided with a groove adapted to receive a sealing member. The groove comprises an inner wall having a plurality of restrictive openings configured to restrict the flow of gas from the groove through the plurality of restrictive openings so as to reduce target arcing during a plasma process within the sputter deposition chamber. A method also is provided for reducing defect formation during plasma processing. The method comprises providing a sputter deposition chamber having at least one sealing surface; and restricting the flow of gas from the at least one sealing surface into the sputter deposition chamber so as to reduce target arcing during sputter deposition within the sputter deposition chamber.

Abstract: A method is provided for reducing the number of particles within a chamber of a fabrication tool located within a gray area of a clean room. A portable clean room station is provided that is capable of producing a white environment having fewer particles than the gray environment. The portable clean room station is positioned so that the chamber is exposed to the white environment of the portable clean room station rather than to the gray environment when the chamber is opened within the gray area. The white environment, which has fewer particles than the gray environment, is produced by employing the portable clean room station, and the chamber is then opened. Thereafter maintenance is performed on the opened chamber. Preferably the white environment is selected so as to have at least two orders of magnitude fewer particles per cubic foot than the gray environment.