Abstract: In various embodiments a solar cell may include a solar cell wafer substrate made of silicon having a major share of mono crystalline structure with {111} crystal plane parallel to one wafer edge; a dielectric layer disposed over the backside of solar cell wafer substrate; a plurality of contact openings extending through the dielectric layer to the solar cell wafer substrate; a plurality of metal contacts formed in the plurality of contact openings; and a metal layer disposed over the dielectric layer; wherein the metal layer is electrically coupled to the solar cell wafer substrate by means of the plurality of metal contacts; wherein at least one contact opening of the plurality of contact openings extends non parallel to {111} crystal plane.

Abstract: A solar cell includes a silicon substrate with a front-side and a rear-side; a dielectric layer structure on the rear-side of the silicon substrate, wherein the dielectric layer structure includes a plurality of through openings by means of which the rear-side of the silicon substrate is exposed; a printed Aluminum-containing metallization layer on the dielectric layer structure on the rear-side of the silicon substrate and at least partially in the through openings for electrically contacting the rear-side of the silicon substrate; wherein the Aluminum-containing metallization includes a lower layer thickness in a first area than in a second area, or the first area is free from the Aluminum-containing metallization; wherein at least one through opening of the plurality of through openings is at least partially disposed in the first area or borders on the first area or has a distance from the first area of less than 500 ?m.

Abstract: Solar cell including a semiconductor substrate with a first and second side, a first contact structure disposed in the region of the first side of the semiconductor substrate and contacting the semiconductor substrate, a passivation layer with openings disposed on the second side of the semiconductor substrate, and a second contact structure disposed on the passivation layer, which locally contacts the semiconductor substrate through the openings of the passivation layer, wherein the first contact structure has a strip-shaped connection element and contact fingers connected to the connection element, and wherein the passivation layer has an openings-free region extending along the connection element in a region under the strip-shaped connection element of the first contact structure.

Abstract: In various embodiments, a solar cell is provided, comprising: a substrate with a front-side and a rear-side, wherein at least the front-side receives light; a passivation layer on the rear-side of the substrate; local contact openings, which pass through the passivation layer and partially expose the rear-side of the substrate; and a first rear-side metallization on the passivation layer and in the local contact openings; wherein the plurality of the local contact openings are disposed such that they are completely covered by the first rear-side metallization.

Abstract: In various embodiments a solar cell may include a solar cell wafer substrate made of silicon having a major share of mono crystalline structure with {111} crystal plane parallel to one wafer edge; a dielectric layer disposed over the backside of solar cell wafer substrate; a plurality of contact openings extending through the dielectric layer to the solar cell wafer substrate; a plurality of metal contacts formed in the plurality of contact openings; and a metal layer disposed over the dielectric layer; wherein the metal layer is electrically coupled to the solar cell wafer substrate by means of the plurality of metal contacts; wherein at least one contact opening of the plurality of contact openings extends non parallel to {111} crystal plane.