Patents by Inventor Roman Siegfried Schichl

Roman Siegfried Schichl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8378775
    Abstract: Transformers (1) for transforming primary signals into secondary signals comprise primary and secondary parts that comprise boards (11-14, 21-23) with turns. By introducing distances larger than zero between for example any pair of neighboring boards (11-14, 21-23), parasitic capacitances of the transformers (1) are reduced, and the secondary signals may comprise relatively fast/high voltage pulses having rise times >1 kV/?sec. To reduce proximity effects and any resulting losses, the primary and secondary boards (11-14, 21-23) may be stacked in interleaved ways. Such sandwich constructions reduce leakage inductances. In a particular direction, distances between subsequent primary boards (11-14, 21-23) and distances between subsequent combinations of primary and secondary boards (11-14, 21-23) are to be increased to further reduce capacitive losses in that particular direction.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: February 19, 2013
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Wolfgang Schiene, Georg Greuel, Marc Maria Alex Bleukx, Roman Siegfried Schichl
  • Publication number: 20100253461
    Abstract: Transformers (1) for transforming primary signals into secondary signals comprise primary and secondary parts that comprise boards (11-14, 21-23) with turns. By introducing distances larger than zero between for example any pair of neighboring boards (11-14, 21-23), parasitic capacitances of the transformers (1) are reduced, and the secondary signals may comprise relatively fast/high voltage pulses having rise times>1 kV/?sec. To reduce proximity effects and any resulting losses, the primary and secondary boards (11-14, 21-23) may be stacked in interleaved ways. Such sandwich constructions reduce leakage inductances. In a particular direction, distances between subsequent primary boards (11-14, 21-23) and distances between subsequent combinations of primary and secondary boards (11-14, 21-23) are to be increased to further reduce capacitive losses in that particular direction.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 7, 2010
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Wolfgang Schiene, Georg Greuel, Marc Maria Alex Bleukx, Roman Siegfried Schichl