Patents by Inventor RomanoLuigi

RomanoLuigi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink
    Patent number: 5001547
    Abstract: A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein.
    Type: Grant
    Filed: August 7, 1989
    Date of Patent: March 19, 1991
    Assignee: SGS Microelettronica S.p.A.
    Inventor: RomanoLuigi