Abstract: Devices, systems, and methods for laser processing semiconductor materials are provided. In one aspect, a system for uniformly laser irradiating at least one wafer can include a wafer platter operable to receive and support a one or more wafers, a rotational movement system coupled to the wafer platter, the rotational movement system being operable to rotate the wafer platter in at least one of a clockwise or a counter clockwise direction, and a linear movement system coupled to the wafer platter and operable to move the wafer platter along one or more linear axes. The system can also include a laser source oriented to deliver laser radiation onto a wafer supported by the wafer platter at a fixed angle relative to the surface of the wafer, where the rotational movement system and the linear movement system are operable to maintain the fixed angle across the entirety of the wafer surface.