Patents by Inventor Romel Nogas MANATAD

Romel Nogas MANATAD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate interposer on a leaderframe
    Patent number: 11296069
    Abstract: In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: April 5, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Maria Cristina Estacio, Romel Nogas Manatad, Chung-Lin Wu, Jerome Teysseyre
  • SUBSTRATE INTERPOSER ON A LEADFRAME
    Publication number: 20200219866
    Abstract: In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 9, 2020
    Applicant: FAIRCHILD SEMICONDUCTOR CORPORATION
    Inventors: Elsie Agdon CABAHUG, Marie Clemens Ypil QUINONES, Maria Cristina ESTACIO, Romel Nogas MANATAD, Chung-Lin WU, Jerome TEYSSEYRE
  • Substrate interposer on a leadframe
    Patent number: 10546847
    Abstract: In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: January 28, 2020
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Maria Cristina Estacio, Romel Nogas Manatad, Chung-Lin Wu, Jerome Teysseyre
  • SUBSTRATE INTERPOSER ON A LEADFRAME
    Publication number: 20160284631
    Abstract: In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 29, 2016
    Inventors: Elsie Agdon CABAHUG, Marie Clemens Ypil QUINONES, Maria Cristina ESTACIO, Romel Nogas MANATAD, Chung-Lin WU, Jerome TEYSSEYRE