Patents by Inventor Romeo Alvarez Saboco

Romeo Alvarez Saboco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor device packaging
    Patent number: 8324025
    Abstract: A method for packaging one or more power semiconductor devices is provided. A lead frame comprising one or more base die paddles, multiple lead terminals, and a tie bar assembly is constructed. The lead terminals extend to a predetermined elevation from the base die paddles. The base die paddles are connected to the lead terminals by the tie bar assembly. The tie bar assembly mechanically couples the base die paddles to each other and to the lead terminals. The tie bar assembly is selectively configured to isolate the lead terminals from the base die paddles and to enable creation of multiple selective connections between one or more of the lead terminals and one or more power semiconductor devices mounted on the base die paddles, thereby enabling flexible packaging of one or more isolated and/or non-isolated power semiconductor devices and increasing their power handling capacity.
    Type: Grant
    Filed: April 9, 2011
    Date of Patent: December 4, 2012
    Assignee: Team Pacific Corporation
    Inventor: Romeo Alvarez Saboco
  • Power Semiconductor Device Packaging
    Publication number: 20110260305
    Abstract: A method for packaging one or more power semiconductor devices is provided. A lead frame comprising one or more base die paddles, multiple lead terminals, and a tie bar assembly is constructed. The lead terminals extend to a predetermined elevation from the base die paddles. The base die paddles are connected to the lead terminals by the tie bar assembly. The tie bar assembly mechanically couples the base die paddles to each other and to the lead terminals. The tie bar assembly is selectively configured to isolate the lead terminals from the base die paddles and to enable creation of multiple selective connections between one or more of the lead terminals and one or more power semiconductor devices mounted on the base die paddles, thereby enabling flexible packaging of one or more isolated and/or non-isolated power semiconductor devices and increasing their power handling capacity.
    Type: Application
    Filed: April 9, 2011
    Publication date: October 27, 2011
    Inventor: Romeo Alvarez Saboco