Patents by Inventor Romeo Santos, Jr.

Romeo Santos, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular payload arrangement
    Patent number: 5839696
    Abstract: A modular payload structure providing standardized thermal, electrical and mechanical interfaces. The modular arrangement of the present invention has fixed radiator panels that have standard thermal and mechanical interfaces, allowing communication modules to "plug in" directly to the payload structure. In the case of high thermo-energy dissipating modules, heat pipes on the modules connect to the thermal interfaces and move energy from the modules to the thermal interfaces of the radiator panel.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: November 24, 1998
    Assignee: Hughes Electronics Corporation
    Inventors: Glenn Caplin, James W. Schultz, Romeo Santos, Jr., Gary M. York