Abstract: Assessing color digitally can include imaging digitally a custom color calibration chart under a set of lighting conditions; imaging digitally a workpiece under substantially identical lighting conditions; and comparing color measurement data from the custom color calibration chart to color measurement data from the workpiece to characterize the workpiece.

Abstract: Assessing color digitally can include imaging digitally a custom color calibration chart under a set of lighting conditions; imaging digitally a workpiece under substantially identical lighting conditions; and comparing color measurement data from the custom color calibration chart to color measurement data from the workpiece to characterize the workpiece.

Abstract: Vision systems for robotic assemblies for handling cargo, for example, unloading cargo from a trailer, can determine the position of cargo based on shading topography. Shading topography imaging can be performed by using light sources arranged at different positions relative to the image capture device(s).

Abstract: Vision systems for robotic assemblies for handling cargo, for example, unloading cargo from a trailer, can determine the position of cargo based on shading topography. Shading topography imaging can be performed by using light sources arranged at different positions relative to the image capture device(s).

Abstract: Assessing color digitally can include imaging digitally a custom color calibration chart under a set of lighting conditions; imaging digitally a workpiece under substantially identical lighting conditions; and comparing color measurement data from the custom color calibration chart to color measurement data from the workpiece to characterize the workpiece.

Abstract: Assessing color digitally can include imaging digitally a custom color calibration chart under a set of lighting conditions; imaging digitally a workpiece under approximately identical lighting conditions; and comparing color measurement data from the custom color calibration chart to color measurement data from the workpiece to characterize the workpiece.

Abstract: A machine includes an enclosure having a double layer wall including an outer wall that provides mechanical protection and protection from dust, fluids and environmental factors and an inner wall having a gradient change in reflectance with height within the enclosure; a lens coupled to the enclosure, the lens defining an optic axis-within the enclosure parallel to the gradient change in reflectance with height; a camera coupled to the lens; an image processing circuit coupled to the camera; and a plurality of light sources coupled to the enclosure, the plurality of light sources defining a plurality of illuminant axes located substantially symmetrically around and parallel to the optic-axis. Each of the plurality of light sources includes a plurality of independently controllable segments located along the illuminant axes so an angle of illumination from the plurality of light sources to the optic axis can be controlled.

Abstract: A machine includes an enclosure defining a principle axis; a lens coupled to the enclosure, the lens defining an optic axis that substantially parallel to the principle axis of the enclosure; a camera coupled to the lens; an image processing circuit coupled to the camera; and a plurality of elongated light sources defining a plurality of illuminant axes located substantially symmetrically around the principle axis of the enclosure. Each of the plurality of elongated light sources includes a plurality of independently controllable segments.

Abstract: Assessing color digitally can include imaging digitally a custom color calibration chart under a set of lighting conditions; imaging digitally a workpiece under substantially identical lighting conditions; and comparing color measurement data from the custom color calibration chart to color measurement data from the workpiece to characterize the workpiece.

Abstract: A lighting dome that can be used to inspect semiconductor wafers can include a small aperture, backlighting, a reflectance gradient and/or a broad spectrum light source.

Abstract: A lighting dome that can be used to inspect semiconductor wafers can include a small aperture, backlighting, a reflectance gradient and/or a broad spectrum light source.

Abstract: A lighting dome that can be used to inspect semiconductor wafers includes a small aperture, and can include backlighting, a reflectance gradient and/or a broad spectrum light source. A pin hole lens is aligned with the small aperture.

Abstract: A lighting dome that can be used to inspect semiconductor wafers can include a small aperture, backlighting, a reflectance gradient and/or a broad spectrum light source.