Abstract: A microelectronic package is provided in which a first chip having active elements, e.g. amplifying elements, and passive elements, e.g. resistors, capacitors and inductors, is mounted in electrical communication with a microelectronic element having conductive patterns opposing a front face of the first chip. Absorptive material patterns are disposed between the conductive patterns of the microelectronic element and at least some of the passive elements while leaving at least some of the active elements exposed so as to attenuate radio frequency energy propagated by wave between the passive devices and conductive patterns of the microelectronic element. A packaged chip is also provided in which a chip is disposed beneath a package element, the chip having an opening which extends between a front face and a rear face of the chip, a conductor being disposed in the opening which is conductively connected to a conductive element of the package element.

Abstract: A new physical design for electronic devices (100) comprises a multi-layer stacked assembly (104-110) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array (208) or a filter array (314) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges (122, 124) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g.

Abstract: A “Gatling gun” via to interconnect circuitry from a first side of a substrate or printed circuit board, to a second side of the substrate or board. The present via structure comprises a center conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the center conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. In one embodiment, the conductor via is electrically connected to a conductive pattern on the substrate by a wire bond.

Abstract: A high-frequency, e.g., microwave, filter (100, 300, 400) is made, e.g., stamped or etched, from a single sheet (110, 310, 410) of electrically conductive material, e.g., a metal plate or a printed circuit board. The sheet defines a frame (112, 312, 412-413), one or more resonant filter elements (114, 311-315, 411-415) inside of the frame, one or more supports (116, 316-317, 416) connecting each resonant filter element to the frame, and a flange (118, 318, 418) on one of the resonant filter elements. The flange serves as an electrical contact to the filter; another flange (317, 417) on another element, or the frame itself, serves as a second contact. An electrically conductive housing (104, 304, 404) encapsulates both faces of the sheet.

Abstract: A transceiver (100) comprises a stacked metal laminate assembly of a plurality of layers (104-112) inside an enclosure (102). A first layer (104) forms an antenna. A second layer (106) forms a ground plane for the antenna. A third layer (108) forms “front-end” filters (duplexer). A fourth layer (110) together with the second layer forms an electromagnetic isolation enclosure for the filters. A fifth layer (112) comprises a PC board with electronic circuits of the transceiver mounted thereon, and is both mounted to and electronically shielded by the fourth layer. Each of the first through fourth layers is preferably made from a single metal layer, such as a sheet of metal, by stamping. Each of the first through fourth layers is either bent along its periphery into a substantially “cake-pan” shape, or is flat and has a separate side wall (130) attached thereto.

Abstract: A high-frequency, e.g., microwave, antenna (100) is stamped from a single sheet (300) of electromagnetically conductive material, e.g., a metal plate. A manufacture comprising a frame (104), a plurality of radiator antenna elements (108), a plurality of first supports (112) each connecting a radiator antenna element to the frame, a feed network (110) connected to the radiator antenna elements, and a plurality of second supports (304) connecting the radiators and the feed network to each other and to the frame, are stamped out of the single sheet. A combiner (114) may be included in the manufacture as well. The second supports provide alignment and rigidity during manufacture and assembly. Preferably, a plurality of the manufactures are stamped out side-by-side from a single roll (400) for ease of automated manufacture and assembly.

Abstract: A resonant capacitive coupler (124) couples signals across a gap (126) between signal transmission lines (112, 118) of two printed wiring boards (100, 102). The coupler has a conductive contact member (202 or 302) that is either positioned in close proximity to one of the transmission lines (112) or is connected to the one transmission line via a dielectric (204 or 304), and forms a capacitor therewith. The coupler further has a conductive interconnect member (200 or 300) that is connected to the contact member, and also to the other transmission line (108) either directly (FIG. 3) or via a second conductive contact member (202) (FIG. 2). The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members.

Abstract: A bandpass planar filter (110) comprises a signal input and a signal output (116), and one or more resonator elements (112, 114) coupled serially end-to-end between the input and the output across gaps (118) that separate the elements from the input, the output, and from each other. The resonator elements form a serpentine shape such that at least two portions of the serpentine shape are positioned side-by-side parallel to each other separated by a spacing (120). The side-by-side portions effect additional coupling between the resonator elements that forms a notch (transmission zero) (204) in the passband (200) of the filter. The input, output, and resonator elements are etched into one surface (106) of a PC board (102); the other surface (104) of the PC board forms a ground plane of the filter, and the substrate (103) of the PC board forms a dielectric of the filter.

Abstract: A “Gatling gun” via to interconnect circuitry from a first side of a substrate or printed circuit board, to a second side of the substrate or board. The present via structure comprises a center conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the center conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. In one embodiment, the conductor via is electrically connected to a conductive pattern on the substrate by a wire bond.

Abstract: A surface mountable coaxial solder interconnect. The invention provides a small, low-cost, passively self-aligning, high-frequency electronic interconnect adapted to mass production and method. The invention includes a substrate, a signal conductor, and an annular conductor. The substrate incorporates an annular pad and a signal pad substantially centered within the annular pad. The signal conductor includes reflowed solder and is wetted to the signal pad. Similarly, the annular conductor includes reflowed solder and is wetted to the annular pad. The invention may also provide a second substrate substantially parallel to the first substrate that includes a second annular pad and a second signal pad substantially centered within the second annular pad. In such a case, the signal conductor is also wetted to the second signal pad, and, similarly, the annular conductor is also wetted to the second annular pad. The method of the invention includes obtaining a mask and a substrate.

Abstract: A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.

Abstract: A coaxial connector mounts directly to a planar substrate of a circuit module and is oriented perpendicularly to the substrate. A radially symmetric coaxial structure, maintained through a conductive bore in the substrate provides a good impedance match to a planar transmission line on the substrate. A flange of the coaxial connector provides the mating surface to the substrate. A nipple formed on the flange fits in the conductive bore, aligning the center conductor in the conductive bore and maintaining the coaxial structure. A bond connects the center conductor to a microstrip transmission line on the top of the substrate. In a first preferred embodiment of the present invention, a threaded flange receives a threaded coaxial bead to form the coaxial connector. In a second preferred embodiment a coaxial cable is soldered into a smooth flange to form a coaxial connector. In a third preferred embodiment a coaxial bead and a flange are integrated to form the coaxial connector.

Abstract: A lossy capacitive circuit element, or DC scrubber, is printed on a circuit substrate and absorptively filters high frequency signals in circuit modules. A top conductor of the DC scrubber is separated from a ground conductor by a layer of high dielectric material. A resistive layer, positioned either above or below the top conductor absorbs high frequency signals applied to the top conductor while the dielectric layer shunts the signals to the ground conductor. Alternatively, a pair of DC scrubbers are stacked vertically to configure the lossy capacitive structures in parallel. Signal isolation provided by the DC scrubber and the stacked DC scrubber enables inexpensive DC interfaces to be used in the circuit modules.

Abstract: A signal distribution structure, or polyline, provides isolation between signal paths in high frequency systems, such as RF or microwave communication systems. The polyline has an inner conductor surrounded by a lossy insulator and a conductive shield. The conductive shield isolates the inner conductor from high frequency signals in the system while the lossy insulator attenuates high frequency signals present on the inner conductor. Low frequency signals on the inner conductor are relatively unattenuated by the polyline. Alternatively, an open polyline is formed in which the conductive shield is absent. The polyline and the open polyline are printed on a ceramic substrate or other type of carrier using known thick-film processing techniques.