Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.

Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and a security chip that is operatively coupled to the IC. The IC may comprise a plurality of solder balls operatively coupled thereto and configured for physical and electrical connection between the IC and the PCB. The security chip is configured to detect a potential tampering of the IC.

Abstract: Methods are described herein for manufacturing multi-component objects using artificial intelligence. The present invention may be directed to a method that includes determining an actual value of a first attribute of a first component of an object and determining, using a machine learning model and based on the actual value of the first attribute, an optimized value for a second attribute of a second component that is functionally interrelated to the first component in the object. The method may include selecting, from a plurality of second components each having a value for the second attribute within a tolerance range, a second component having the optimized value for the second attribute. The method may further include manufacturing the object using the first component and the selected second component.

Abstract: A heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. The housing defines a chamber that holds working fluid. The wick structure includes a body and pores defined by the body. The heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. The wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. The body of the wick structure may have a gyroidal geometry. Associated methods are also provided.

Abstract: Methods are described herein for artificial-intelligence-based manufacturing. The present invention may include performing an initial step in a series of steps to achieve a target value of an attribute, where the series of steps is for manufacturing an object, and, after performing the initial step, measuring an actual value of the attribute achieved by the initial step. The method may include, for each subsequent step in the series, providing actual values of attributes achieved by preceding steps in the series to a respective machine learning model to determine a respective target value for a respective attribute to be achieved by the respective step. The method may also include, for each step, performing the respective step to achieve the respective target value of the respective attribute and, after performing the respective step, measuring a respective actual value of the respective attribute achieved by the respective step.

Abstract: Aspects of the present invention are directed to techniques for improving the manufacturing control mechanisms—specifically game controllers—for computerized electronic devices. According to one aspect of the present invention, a button assembly is provided that eliminates the need for dampers or gaskets for shock absorption by implementing the hammer and pad using novel and advantageous geometries. According to one embodiment, the bottom or striking surface of the hammer in a button assembly is implemented at an angle, which, when pressed, strikes a similarly angled surface of the landing pad. The slope of the corresponding angles cause the hammer to slide along the angled surface, and for the kinetic force of the impact to be redirected as shearing force away from the button assembly (and the corresponding user appendage).

Abstract: Aspects of the present invention are directed to techniques for improving the manufacturing control mechanisms—specifically game controllers—for computerized electronic devices. According to one aspect of the present invention, a button assembly is provided that eliminates the need for dampers or gaskets for shock absorption by implementing the hammer and pad using novel and advantageous geometries. According to one embodiment, the bottom or striking surface of the hammer in a button assembly is implemented at an angle, which, when pressed, strikes a similarly angled surface of the landing pad. The slope of the corresponding angles cause the hammer to slide along the angled surface, and for the kinetic force of the impact to be redirected as shearing force away from the button assembly (and the corresponding user appendage).

Abstract: In accordance with an example embodiment of the present invention, an apparatus is disclosed. The apparatus includes a first housing section, a second housing section, and a connection mechanism between the housing sections. The connection mechanism includes a first hinge member, a slide plate, second hinge member, a first hinge arm, and a second hinge arm. The first hinge member includes an elongated opening. The slide plate is attached to the second housing section. The second hinge member is connected to the slide plate. The first end of the first hinge arm is connected to the first housing section. The second end of the first hinge arm is connected to the second hinge member. The first end of the second hinge arm is connected to the first hinge member at the elongated opening. The second end of the second hinge arm is connected to the second hinge member.

Abstract: In accordance with an example embodiment of the present invention, an apparatus is disclosed. The apparatus includes a first housing section, a second housing section, and a connection mechanism between the housing sections. The connection mechanism includes a first hinge member, a slide plate, second hinge member, a first hinge arm, and a second hinge arm. The first hinge member includes an elongated opening. The slide plate is attached to the second housing section. The second hinge member is connected to the slide plate. The first end of the first hinge arm is connected to the first housing section. The second end of the first hinge arm is connected to the second hinge member. The first end of the second hinge arm is connected to the first hinge member at the elongated opening. The second end of the second hinge arm is connected to the second hinge member.