Patents by Inventor Ron CHERTAKOVSKY

Ron CHERTAKOVSKY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260209540
    Abstract: Improved conductive ink compositions and methods of making and using the conductive ink compositions are provided. The improved conductive ink compositions include a silver complex formed by mixing a silver carboxylate, specifically a silver decanoate isomer, and at least one dissolving agent, in particular where the at least one dissolving agent comprises a terpene, a terpenoid, or a combination thereof. The silver carboxylate of the subject ink compositions is decarboxylated at a temperature of 250° C. or less. The conductive ink compositions preferably further comprise a non-acid stabilizer and optionally further comprise an acid stabilizer and/or an adhesion promoter. Methods of making conductive structures, including methods wherein the disclosed compositions are applied to a suitable substrate by various techniques, are also provided.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 23, 2026
    Applicant: ELECTRONINKS INCORPORATED
    Inventors: S. Brett WALKER, Melburne LEMIEUX, K.L. Iresha Sampathi PERERA, Garret MCKERRICHER, Ron CHERTAKOVSKY, Scott Soung Jae LEE
  • Publication number: 20250188301
    Abstract: Improved conductive ink compositions are provided. The improved conductive ink compositions include a silver complex formed by mixing a silver carboxy late, specifically a silver decanoate isomer, and at least one dissolving agent, in particular where the at least one dissolving agent comprises a terpene, a terpenoid; or a combination thereof. The silver carboxy late of the subject ink compositions is decarboxylated at a temperature of 250° C. or less, optionally in the presence of an adhesion promoter and/or an acid stabilizer, to form a conductive structure. Methods of making conductive structures, including methods wherein the disclosed compositions are applied to a substrate by various techniques, are also provided.
    Type: Application
    Filed: March 5, 2023
    Publication date: June 12, 2025
    Applicant: ELECTRONINKS INCORPORATED
    Inventors: S. Brett WALKER, Melburne LEMIEUX, K.L. Iresha Sampathi PERERA, Garret MCKERRICHER, Ron CHERTAKOVSKY, Scott Soung Jae LEE