Patents by Inventor Ron D. Kohler

Ron D. Kohler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming physical vapor deposition target/backing plate assemblies
    Patent number: 6649449
    Abstract: The invention encompasses PVD target/backing plate assemblies which include a PVD target having a surface, and a bonding layer on the surface. The bonding layer has a different composition than the target surface, and a backing plate is provided to be separated from the PVD target surface by at least the bonding layer. The bonding layer forms a strong diffusion bond to the target. The invention also includes methods of forming PVD target/backing plate assemblies. Additionally, the invention includes assemblies in which one or more of titanium, zirconium, and copper is incorporated into a bonding layer between a target and a backing plate in a physical vapor deposition target/backing assembly.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: November 18, 2003
    Assignee: Honeywell International Inc.
    Inventors: Ron D. Kohler, Matthew S. Cooper
  • Methods of forming physical vapor deposition target/backing plate assemblies
    Publication number: 20020068386
    Abstract: The invention encompasses PVD target/backing plate assemblies which include a PVD target having a surface, and a bonding layer on the surface. The bonding layer has a different composition than the target surface, and a backing plate is provided to be separated from the PVD target surface by at least the bonding layer. The bonding layer forms a strong diffusion bond to the target. The invention also includes methods of forming PVD target/backing plate assemblies. Additionally, the invention includes assemblies in which one or more of titanium, zirconium, and copper is incorporated into a bonding layer between a target and a backing plate in a physical vapor deposition target/backing assembly.
    Type: Application
    Filed: January 3, 2002
    Publication date: June 6, 2002
    Inventors: Ron D. Kohler, Matthew S. Cooper
  • Physical vapor deposition target/backing plate assemblies
    Patent number: 6376281
    Abstract: The invention encompasses PVD target/backing plate assemblies which include a PVD target having a surface, and a bonding layer on the surface. The bonding layer has a different composition than the target surface, and a backing plate is provided to be separated from the PVD target surface by at least the bonding layer. The bonding layer forms a strong diffusion bond to the target. The invention also includes methods of forming PVD target/backing plate assemblies. Additionally, the invention includes assemblies in which one or more of titanium, zirconium, and copper is incorporated into a bonding layer between a target and a backing plate in a physical vapor deposition target/backing assembly.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: April 23, 2002
    Assignee: Honeywell International, Inc.
    Inventors: Ron D. Kohler, Matthew S. Cooper