Abstract: A flexible circuit board includes a flexible substrate having a first portion, a second portion, and a first side defining part of the first portion and the second portion. Electrical components are disposed on the first side in the first portion and in the second portion. The flexible substrate is folded between the first portion and the second portion such that the first portion overlays the second portion and the first side is directed outwards.

Abstract: An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.

Abstract: An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a perimeter; a compression gasket extending around at least a portion of the perimeter of the printed circuit board; and a housing including a first wall and a housing side wall extending from the first wall, the first wall and housing side wall form a cavity, wherein the printed circuit board and the compression gasket are located within the cavity with the compression gasket positioned between the perimeter and the housing side wall.

Abstract: An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.

Abstract: An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a perimeter; a compression gasket extending around at least a portion of the perimeter of the printed circuit board; and a housing including a first wall and a housing side wall extending from the first wall, the first wall and housing side wall form a cavity, wherein the printed circuit board and the compression gasket are located within the cavity with the compression gasket positioned between the perimeter and the housing side wall.

Abstract: A component assembly includes a printed circuit board having an electronics component mounted on a first portion of a first face of the printed circuit board. A light emitting diode is mounted on a second portion of the first face. A light guide of a light transmissive polymeric material covers the body including the light emitting diode and the electronics component. The light guide includes: a cavity having the electronics component positioned within the cavity; a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity; and a second cavity having the light emitting diode positioned within the second cavity; and a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode.

Abstract: A flexible circuit board includes a flexible substrate having a first portion, a second portion, and a first side defining part of the first portion and the second portion. Electrical components are disposed on the first side in the first portion and in the second portion. The flexible substrate is folded between the first portion and the second portion such that the first portion overlays the second portion and the first side is directed outwards.

Abstract: A component assembly includes a printed circuit board having an electronics component mounted on a first portion of a first face of the printed circuit board. A light emitting diode is mounted on a second portion of the first face. A light guide of a light transmissive polymeric material covers the body including the light emitting diode and the electronics component. The light guide includes: a cavity having the electronics component positioned within the cavity; a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity; and a second cavity having the light emitting diode positioned within the second cavity; and a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode.

Abstract: A printed film with mounted light emitting diodes encapsulated in a light guide includes a printed film assembly. The printed film assembly includes multiple light emitting diodes. A light guide is injection molded onto a first side of the body covering the light emitting diodes. A light transmissive polymeric material coating layer is applied by injection molding to a second side of the body opposite to the first side. An overmolded component has the printed film assembly embedded therein, with the coating layer exposed for visibility of light from the light emitting diodes when at least one of the light emitting diodes is energized.

Abstract: A laminated light guide and component carrier includes a light guide of a light transmissive polymeric material. The light guide has a pocket in a first face. First electrical traces are printed on the first face. A light emitting diode is positioned in the pocket and supported on the light guide by attachment legs which extend outward from the pocket electrically connecting the light emitting diode to the first electrical traces. A light reflector is formed as a texturally modified area of the light guide directly aligned with the light emitting diode. A capacitive touch sensor is printed on a light guide second face and connected to second electrical traces defining capacitive touch traces printed on the second face. A window region of the light guide is defined where the capacitive touch sensor is aligned with the light reflector and the light emitting diode.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material is positioned over the light emitting diodes and the electronic components. The light guide includes: a contact surface directly contacting the first portion of the first face except at locations of the light emitting diodes; a cavity created in the contact surface, the electronics components located within the cavity when the contact surface directly contacts the first portion of the first face; and a through hole extending through a body of the light guide and opening into the cavity.

Abstract: A component assembly includes a body having an electronics component mounted on a first face of the body. A light emitting diode is mounted on a first portion of the first face. A top plate is attached to the body and covers the light emitting diode and the electronics component. The top plate includes: a first cavity having the electronics component positioned within the first cavity; and a first support area homogeneously connected to the top plate and extending from the top plate to directly contact the body outside of the cavity to provide support for the top plate and to mitigate against collapse of the cavity.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer is affixed onto the first face outside of the light guide.

Abstract: A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material is positioned over the light emitting diodes and the electronic components. The light guide includes: a contact surface directly contacting the first portion of the first face except at locations of the light emitting diodes; a cavity created in the contact surface, the electronics components located within the cavity when the contact surface directly contacts the first portion of the first face; and a through hole extending through a body of the light guide and opening into the cavity.

Abstract: A light guide assembly includes a metal material printed circuit board. A light emitting diode is mounted on and extends away from a first face of the printed circuit board. A light guide molded from a light transmissive polymeric material is positioned proximate to the light emitting diode and is at least partially received in a concomitantly shaped through bore pre-formed in the printed circuit board. The light guide includes an extended feature co-molded from the same material as the light guide and extending away from the first face of the printed circuit board in an installed position of the light guide. The extended feature includes a first extended feature having a first length and a second extended feature having a second length, the second length greater than the first length.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer is affixed onto the first face outside of the light guide.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.

Abstract: A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.