Patents by Inventor Ron Guo

Ron Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER ALIGNMENT STRUCTURE
    Publication number: 20240136303
    Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.
    Type: Application
    Filed: February 23, 2022
    Publication date: April 25, 2024
    Inventors: Yong guo Li, Rishabh Bhandari, Aydin Nabovati, Ron Rosenberg, Vijaykumar Krithivasan, Mitchell Heschke
  • Audio device
    Patent number: D879738
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: March 31, 2020
    Assignee: BLACK & DECKER INC.
    Inventor: Ron Guo