Patents by Inventor Ron Mendelson

Ron Mendelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated multi-layer test pads and methods therefor
    Patent number: 5981302
    Abstract: A multi-layer test pad on a semiconductor wafer, which includes an underlying matrix of interconnected first pads, which are arranged in rows and columns. The multi-layer test pad includes an oxide layer disposed above the underlying matrix and in between the rows and columns. The multi-layer test pad further includes an overlying matrix of interconnected second pads disposed above the oxide layer. Each of the second pads completely overlaps at least nine of the first pads, including four oxide regions surrounding a center first pad of the nine of the first pads. The nine of the first pads are arranged as 3.times.3 block of the first pads.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: November 9, 1999
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corporation
    Inventors: Frank Alswede, William Davies, Ronald Hoyer, Ron Mendelson, Frank Prein
  • Integrated multi-layer test pads
    Patent number: 5917197
    Abstract: A multi-layer test pad on a semiconductor wafer, which includes an underlying matrix of interconnected first pads, which are arranged in rows and columns. The multi-layer test pad includes an oxide layer disposed above the underlying matrix and in between the rows and columns. The multi-layer test pad further includes an overlying matrix of interconnected second pads disposed above the oxide layer. Each of the second pads completely overlaps at least nine of the first pads, including four oxide regions surrounding a center first pad of the nine of the first pads. The nine of the first pads are arranged as 3.times.3 block of the first pads.
    Type: Grant
    Filed: May 21, 1997
    Date of Patent: June 29, 1999
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corporation
    Inventors: Frank Alswede, William Davies, Ronald Hoyer, Ron Mendelson, Frank Prein