Patents by Inventor Ron Serisky

Ron Serisky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced substrate temperature measurement apparatus, system and method
    Patent number: 11473978
    Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: October 18, 2022
    Assignee: APPLIED Materials, Inc.
    Inventors: Dawei Sun, D. Jeffrey Lischer, Qin Chen, Dale K. Stone, Lyudmila Stone, Steven Anella, Ron Serisky, Chi-Yang Cheng
  • CARBON NANOTUBE ELECTROSTATIC CHUCK
    Publication number: 20210225682
    Abstract: A platen having improved thermal conductivity and reduced friction is disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivity, thus improving the transfer of heat between the platen and the workpiece. Furthermore, the friction between the carbon nanotubes and the workpiece is much lower than that with conventional embossments, reducing particle generation. In another embodiment, a support plate is disposed on the platen, wherein the carbon nanotubes are disposed on the top surface of the support plate.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Inventors: Dawei Sun, Steven M. Anella, Qin Chen, Ron Serisky, Julian G. Blake, David J. Chipman
  • Carbon nanotube electrostatic chuck
    Patent number: 11069554
    Abstract: A platen having improved thermal conductivity and reduced friction is disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivity, thus improving the transfer of heat between the platen and the workpiece. Furthermore, the friction between the carbon nanotubes and the workpiece is much lower than that with conventional embossments, reducing particle generation. In another embodiment, a support plate is disposed on the platen, wherein the carbon nanotubes are disposed on the top surface of the support plate.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: July 20, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Dawei Sun, Steven M. Anella, Qin Chen, Ron Serisky, Julian G. Blake, David J. Chipman
  • SYSTEM AND APPARATUS FOR ENHANCED SUBSTRATE HEATING AND RAPID SUBSTRATE COOLING
    Publication number: 20200381271
    Abstract: A heating system for heating a substrate. The heating system may include a susceptor, where the susceptor has a substrate support surface. The heating system may further include a heat transfer layer, disposed on the substrate support surface, where the heat transfer layer comprising an array of aligned carbon nanotubes.
    Type: Application
    Filed: September 4, 2019
    Publication date: December 3, 2020
    Applicant: APPLIED Materials, Inc.
    Inventors: Dawei Sun, Dale K. Stone, D. Jeffrey Lischer, Lyudmila Stone, Steven Anella, Julian G. Blake, Ron Serisky, Daniel A. Hall, Robert H. Bettencourt
  • ENHANCED SUBSTRATE TEMPERATURE MEASUREMENT APPARATUS, SYSTEM AND METHOD
    Publication number: 20200378837
    Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.
    Type: Application
    Filed: September 4, 2019
    Publication date: December 3, 2020
    Applicant: APPLIED Materials, Inc.
    Inventors: Dawei Sun, D. Jeffrey Lischer, Qin Chen, Dale K. Stone, Lyudmila Stone, Steven Anella, Ron Serisky, Chi-Yang Cheng