Patents by Inventor Ron Tilger

Ron Tilger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ETCH REACTOR SUITABLE FOR ETCHING HIGH ASPECT RATIO FEATURES
    Publication number: 20100099266
    Abstract: Embodiments of the invention provide a method and apparatus that enables plasma etching of high aspect ratio features. In one embodiment, a method for etching is provided that includes providing a substrate having a patterned mask disposed on a silicon layer in an etch reactor, providing a gas mixture of the reactor, maintaining a plasma formed from the gas mixture, wherein bias power and RF power provided the reactor are pulsed, and etching the silicon layer in the presence of the plasma.
    Type: Application
    Filed: September 21, 2009
    Publication date: April 22, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Manfred Oswald, Jivko Dinev, Jan Rupf, Markus Meye, Francesco Maletta, Uwe Leucke, Ron Tilger, Farid Abooameri, Alexander Matyushkin, Denis Koosau, Xiaoping Zhou, Thorsten Lehmann, Declan Scanlan