Abstract: A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of dielectric tapes. The integrated circuit is mounted to the baseplate which has a plurality of tabs that are connected to the lead frame of the package. The power or ground leads of the package are bonded to the corresponding baseplate through the tabs of the metal plate. The lead frame, metal baseplate and dielectric tapes all have center openings to provide clearance for the integrated circuit. The center opening of the tapes are such that the dielectric material extends beyond the ends of the baseplates and lead frame.