Abstract: The present invention relates to methods of generating liquidphobic surfaces, and surfaces prepared by these methods. The methods include generating sub-micron-structured surfaces and coating these surfaces with a liquidphobic coating, such as a hydrophobic coating.

Abstract: An apparatus comprising an engine, a drive shaft, a first electric motor, and a fly wheel assembly. The engine may be positioned in a vehicle. The drive shaft may be configured to rotate an axle. The first electric motor may be configured to rotated the drive shaft. The fly wheel assembly may be coupled to the engine and may be configured to drive the first electric motor based on data stored within the fly wheel assembly.

Abstract: Methods are provided for forming current perpendicular to the plane thin film read heads. In one embodiment, the method comprises the steps of forming a lower sensor lead, forming a lower sensor lead cladding of a low sputter yield material on the lower sensor lead, forming a sensor element on the lower sensor lead cladding, and forming an upper sensor lead coupled to the sensor element. The low sputter yield material helps to reduce redeposition of the lower sensor lead material onto side walls of the sensor element as the sensor element is being formed.

Abstract: A trailing pole-tip for an electromagnetic transducer is formed as a layer oriented substantially perpendicular to other layers of the transducer, allowing the pole-tip to be made much thinner than conventional pole-tips. The novel pole-tip is formed on an edge or sidewall of a base layer instead of being formed on top of an existing layer. Potential errors in pole-tip thickness are much less than standard error tolerances for conventional pole-tip thickness. Having a greatly reduced pole-tip width significantly reduces the track width so that many more tracks can fit on a media surface, providing a large increase in areal density.

Abstract: A computer disk drive (22) having a write head (52) which includes a coil (38), a photoresist insulation layer (66) formed on the coil (38), and an insulation shell layer (102) which is formed on the photoresist insulation layer (66). In the first preferred embodiment (100), the top pole (42) of the write head (52) is formed on the insulation shell layer (102). In the second preferred embodiment (200), the disk drive write gap (76) is formed on the insulation shell layer (102) and the top pole (42) of the write head (52) is formed on the write gap (76). The insulation shell layers (102) in both embodiments are preferably made of dielectric materials (103). Methods of fabrication for these embodiments are also disclosed.

Abstract: The present invention provides an improved thin film write head and method of fabrication capable of providing an ultra-short yoke and/or an ultra-low conductor winding stack. The present invention reduces yoke length and stack height by forming the conductor winding in a trench etched from an insulation layer, preferably formed of an inorganic insulation material. A thin resist mask is used to define the width of the trench while the etch process defines the depth. Preferably, the insulation layer is formed on a different inorganic insulation material to control the etch process, thus, the conductor winding may be formed on the underlying layer. The conductor winding preferably is formed by depositing conductor material so that it fills the trench and then planarizing, such as by chemical mechanical polish, to remove conductor material deposited outside the trench.

Abstract: The present invention provides an improved current perpendicular to the plane thin film read head device and method of fabrication. With the present invention, the lower lead is formed to inhibit accumulation of redeposited lead material on CPP sensor element side walls during CPP sensor formation. In the preferred embodiment, the upper portion of the lower lead, which normally is etched during sensor element formation, is formed of a low sputter yield material to reduce redeposition flux to the sensor side walls. It is also preferred to form the upper portion of a material that also has a low value for the ratio of its sputter yield at the lead milling angle-to-its sputter yield at the side wall milling angle to inhibit redeposition accumulation on the side wall. It is preferred to clad conventional lead material with a low sputter yield ratio, low resistivity material, to inhibit side wall redeposition accumulation while also providing a low resistance lower lead.

Abstract: Methods for reducing feature sizes of devices such as electromagnetic sensors are disclosed. A track width of a MR sensor is defined by a mask having an upper layer with a reduced width and a lower layer with a further reduced width. Instead of or in addition to being supported by the lower layer in the area defining the sensor, the upper layer is supported by the lower layer in areas that do not define the sensor width. In some embodiments the upper layer forms a bridge mask, supported at its ends by the lower layer, and the lower layer is completely removed over an area that will become a sensor. Also disclosed is a mask having more than two layers, with a bottom layer completely removed over the sensor area, and a middle layer undercut relative to a top layer.

Abstract: In at least one embodiment, the apparatus of the invention is a read sensor which includes a shield, a sensor element, a read gap positioned between the shield and the sensor element, and an extra gap positioned between the shield and the sensor element and adjacent the read gap. The sensor element is positioned in a sensor layer. With the sensor element and the shield separated by only the relatively thin gap layer, high sensitivity of the sensor element is obtained. Further, by placing the relatively thick extra gap between the shield and the sensor layer and about the sensor element, the potential for shorting is minimized. The shield can be planarized to keep the read gap and the sensor layer at, and about, the sensor element substantially planar. This, in turn, results in improved control of sensor track widths and greatly reduces the potential for pooling of photoresist.

Abstract: The present invention provides an improved thin film write head and method of fabrication capable of providing an ultra-short yoke and/or an ultra-low conductor winding stack. The present invention reduces yoke length and stack height by forming the conductor winding in a trench etched from an insulation layer, preferably formed of an inorganic insulation material. A thin resist mask is used to define the width of the trench while the etch process defines the depth. Preferably, the insulation layer is formed on a different inorganic insulation material to control the etch process, thus, the conductor winding may be formed on the underlying layer. The conductor winding preferably is formed by depositing conductor material so that it fills the trench and then planarizing, such as by chemical mechanical polish, to remove conductor material deposited outside the trench.

Abstract: The present invention provides a thin film read head having a lower shield pedestal with an adjacent lower extra gap layer. The pedestal may be formed from a lower shield layer with the lower extra gap layer being inset within the lower shield layer so that the top surfaces of the lower extra gap layer and the pedestal are generally planar. This allows for deposition of generally planar lower gap and sensor layers. A sensor element may be defined on the generally planar surface using a bilayer resist structure. The generally planar surface of the sensor layer inhibits resist pooling which could otherwise degrade resist structure and sensor element formation. In a typical embodiment, the read head of the present invention may have a spin valve type sensor element with leads electrically coupled to the sensor element, an upper gap layer extending between the sensor element and the upper shield layer, and an upper extra gap layer disposed between at least a portion of the leads and the upper shield layer.

Abstract: The present invention provides an improved bias magnet-to-magnetoresistive element interface and method of fabrication. In a preferred embodiment, the wall/walls of an MR element opposing a bias layer are formed by over etching to provide vertical side walls without taper. In the preferred embodiment, a protective element is formed over the MR element to protect it during etch processes. In some embodiments, a filler layer is deposited prior to bias layer formation. In CIP embodiments, any portion of the filler layer forming on vertical side walls of the MR element is etched to provide an exposed side wall surface for contiguous bias layer formation. In CPP embodiments, the filler layer forms on a vertical back wall and electrically insulates the MR element from the bias layer.

Abstract: Embodiments in accordance with the thin film write head of the present invention have a lower pole structure, an upper pole structure, and a multilayer write gap extending from an air bearing surface between the upper and lower pole structures. In preferred embodiments, the write gap comprises at least two of: (a) a first layer covering a lower pole tip portion of the lower pole structure, (b) a second layer covering turns of a semiconductor winding, or (c) a third layer covering a winding insulation stack. In more preferred embodiments, the write gap is formed of the first, the second, and the third write gap layers. An advantage of a write head with a multilayer write gap is that it allows better control of write gap thickness. As such, loss of write gap thickness can be compensated for by deposition of the second write gap layers, or by deposition of the third write gap layer.

Abstract: A magnetoresistive device includes a metal layer, formed over a substrate, in which a groove is formed. A magnetoresistive element is formed in the groove, forming two magnetoresistive element portions that are separated by a conductive element. A sense current applied to the metal layer flows through the two magnetoresistive element portions with a predominant current-perpendicular-to-plane component. The method includes techniques that are less complex and less expensive than submicron photolithography to form the above described magnetoresistive device with submicron geometries.

Abstract: A thin film read/write head with a high performance inductive write section that demonstrates good physical pole tip geometry control and is simple and economical to process. The head delineates an air bearing surface, and includes a pedestal formed on a read section. The pedestal includes a back edge that defines a zero throat level which lies in a plane substantially parallel to the air bearing surface. A pole layer is formed over, and separated from the pedestal to define a write gap therebetween. The pole layer includes an angled edge so that a top yoke can be stitched therealong to the pole layer.

Abstract: The present invention provides an write head having an improved upper pole tip-to-yoke stitch. The upper pole tip is formed having an open faced sloping surface at an end of the pole tip distal from an air bearing surface. Preferably the angle of the sloping surface is about 30 degrees. The sloping surface provides a shallow angle for depositing the yoke material over which improves the magnetic properties of the yoke material, particularly in the case of sputtered high moment magnetic materials, and improves the flux flow path through the yoke. As such, the present invention allows conductor coils to be located closer to the air bearing surface without sacrificing yoke material properties and flux flow. The upper pole tip may have a back portion which is formed over an insulation layer located between a write gap layer and a conductor layer. Preferably the insulation layer and the conductor layer or layers are formed having sloping edges with shallow angles of about 30 degrees.

Abstract: The present invention provides an improved bias magnet-to-magnetoresistive element interface and method of fabrication. In a preferred embodiment, the wall/walls of an MR element opposing a bias layer are formed by over etching to provide vertical side walls without taper. In the preferred embodiment, a protective element is formed over the MR element to protect it during etch processes. In some embodiments, a filler layer is deposited prior to bias layer formation. In CIP embodiments, any portion of the filler layer forming on vertical side walls of the MR element is etched to provide an exposed side wall surface for contiguous bias layer formation. In CPP embodiments, the filler layer forms on a vertical back wall and electrically insulates the MR element from the bias layer.

Abstract: The present invention provides an exchange break to define the track width of a read head by selectively isolating an exchange coupling layer from an underlying ferromagnetic layer. In the preferred embodiment, the exchange break is provided over a portion of the free layer of a spin valve device so that it inhibits exchange coupling between an overlying portion of the exchange coupling layer and the underlying free layer to define an active region. It is preferred to form the exchange break of an electrically insulating material, to inhibit current shunting through the exchange break, and of a material that easily etches, to minimize inadvertent etching of the underlying free layer and to ensure complete removal of exchange break material when forming the exchange break from an exchange break layer. A reentrant profile photoresist structure may be used to define the exchange break and to define the exchange coupling layer.

Abstract: The preferred embodiment of the present invention provides a write head having an interlaced conductor coil winding and method of fabrication. The interlaced winding of the present invention may have alternating turns of a first and a second coil. In the preferred embodiment, the side walls of successive coil turns are separated by an ultra thin inorganic insulation which defines the distance between successive turns of the first and second coil. In one method of fabrication, a conductive seed layer is deposited on a generally planar insulative surface, a resist mask is formed on the seed layer, and a conductive material deposited on the exposed seed layer to form the turns of the first coil. The masked portions of the seed layer are removed, after resist mask removal, to electrically isolate the turns of the first coil. The inorganic insulation may be formed in a layer conformal with the first coil. The second coil is formed between the turns of the first coil.

Abstract: In a preferred embodiment, a thin film write head having upper and lower pole structures. In the preferred embodiment of the present invention, a middle coat insulation layer is located over a yoke of the lower pole structure and adjacent a pedestal pole tip of the lower pole structure. A trench is formed in the middle coat layer by etching part way into the middle coat layer. A conductor coil is formed on the middle coat so that a portion of the coil is located within the trench and a portion above the trench. Preferably, the middle coat is planarized and then etched using a resist mask to form the trench. With one method, the resist mask is removed after etching the trench, a conductor seed layer deposited, a resist mask formed on the seed layer, a conductor coil formed within the mask, and the seed layer etched after resist mask removal to electrically isolate the turns of the coil.