Abstract: A chip or die attachment process and related apparatus, in which a desired quantity of solder (7 or 17) is dispensed onto each, in turn, of a number of desired locations on a substrate (4 or 18), and then an integrated-circuit chip (10) is precisely positioned at each location immediately after the solder is dispensed at that location. Hot gas heaters are used both to heat the solder (7 or 17) as it is dispensed onto the substrate (4 or 18), and to heat the integrated-circuit chip (10) and to reflow the solder beneath the chip. In one form of the invention, the solder is dispensed from a wire spool (1) and melted in position on the substrate (4). Alternatively, the solder is dispensed as a drop (16) from a liquid solder reservoir (13).

Abstract: A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and disposed in a conducting solution. The mass of each metal components is determined by Faraday's law. The target is also disposed in the conducting solution. Plating current is independently applied to each anode. The plating is conducted under an ultraviolet light sources to optimize the process. The plating alloys can be used for various purposes including attaching a semiconductor die to a substrate. Since the process does not involve exposure of the semiconductor die to a relatively high temperature for a relatively long time, the process does not pose a risk of contamination of the semiconductor by the adhesive or wax used to hold the die in place on the carrier during processing.

Abstract: A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and disposed in a conducting solution. The mass of each metal components is determined by Faraday's law. The target is also disposed in the conducting solution. Plating current is independently applied to each anode. The plating is conducted under an ultraviolet light sources to optimize the process. The plating alloys can be used for various purposes including attaching a semiconductor die to a substrate. Since the process does not involve exposure of the semiconductor die to a relatively high temperature for a relatively long time, the process does not pose a risk of contamination of the semiconductor by the adhesive or wax used to hold the die in place on the carrier during processing.

Abstract: A chip or die attachment process and related apparatus, in which a desired quantity of solder (7 or 17) is dispensed onto each, in turn, of a number of desired locations on a substrate (4 or 18), and then an integrated-circuit chip (10) is precisely positioned at each location immediately after the solder is dispensed at that location. Hot gas heaters are used both to heat the solder (7 or 17) as it is dispensed onto the substrate (4 or 18), and to heat the integrated-circuit chip (10) and to reflow the solder beneath the chip. In one form of the invention, the solder is dispensed from a wire spool (1) and melted in position on the substrate (4). Alternatively, the solder is dispensed as a drop (16) from a liquid solder reservoir (13).

Abstract: A method of making a micro-miniature switch device (10), which has at least one member (68) movable relative to a substrate (12) upon which the device is provided, includes providing a layer of sacrificial non-photolithography material upon a stratum connected to the substrate. A template is provided via photolithographing step that uses a photoresist material upon a stratum connected to the substrate. A layer is provided to include at least a portion of the movable member. The photoresist material and the sacrificial non-photolithography material are removed using photoresist developer. Preferably, at least two photolithography process steps utilize a single photolithographic mask. Also preferably, substrate material is removed to create a recess and at least one channel into the substrate, wherein the channel intersects the recess. At least a portion of the movable member is provided at a location within the recess and at least a portion of the movable member is provided at a location within the channel.

Abstract: A micro-miniature switch apparatus (10) includes a substrate (12) having a surface (14) with first and second channels (16, 18) extending from the surface (14) into the substrate (12). The first and second channels (16, 18) are spaced apart from each other, with a channel axis (20) extending longitudinally through the first and second channels (16, 18). A body (68) that is movable relative to the substrate (12) includes two arms (70, 72). Each of the arms (70, 72) extends into one of the first and second channels (16, 18) to support the body (68) for movement relative to the substrate (12) between first and second electrical conditions of the switch apparatus (10).

Abstract: A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.

Abstract: An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. The apparatus comprises a frame member for mounting a feedthrough member into a housing. The frame member includes a buffer section having a plurality of sections, each section having a material which progressively varies the coefficient of thermal expansion. The frame member further includes additional stress relief features and structural elements facilitating manufacture and assembly of the apparatus.

Abstract: A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.