Abstract: Embodiments of a thin film transistor (TFT) are disclosed.

Abstract: A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Abstract: A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.

Abstract: A method comprising adjusting a first relative position between a substrate and a fabrication unit by a first shift value, forming a first pattern relative to a first pattern instance on the substrate subsequent to adjusting the first relative position by the first shift value, and calculating a second shift value using a first displacement between the first pattern and the first pattern instance and a second displacement between a second relative position of the first pattern instance with respect to a second pattern instance is provided.

Abstract: A plastic substrate is provided, on which is disposed a sacrificial polymer layer and a thin metal film over the sacrificial polymer layer. The thin metal film is laser-delamination patterned. The sacrificial polymer layer is at least partially removed via laser delamination where the thin metal film has been removed via laser delamination.

Abstract: A method comprising adjusting a first relative position between a substrate and a fabrication unit by a first shift value, forming a first pattern relative to a first pattern instance on the substrate subsequent to adjusting the first relative position by the first shift value, and calculating a second shift value using a first displacement between the first pattern and the first pattern instance and a second displacement between a second relative position of the first pattern instance with respect to a second pattern instance is provided.

Abstract: An optical disc of one embodiment of the invention is disclosed that includes a first surface, a second surface, an optically writable label area, and an optically writable data area. The first and the second surfaces are oppositely situated to one another. The label area is on one of the first and the second surfaces. The data area is on one of the first and the second surfaces. The mechanism aids proper focusing of an optical beam of an optical disc device on the optically writable label area and on the optically writable data area.

Abstract: Systems and methods for forming templates for trace or circuit deposition are described. Specifically, a method of forming a template for trace or circuit deposition can comprise steps of jetting an ink-jettable composition onto a substrate in a predetermined pattern, wherein the ink-jettable composition includes a liquid vehicle and at least one coupling agent dispersed therein. The substrate can include functional groups interactive with the coupling agent, wherein upon contact between the coupling agent and the substrate after the jetting step, the coupling agent becomes attached or attracted to the substrate. The method can also include the step of contacting the coupling agent with a metal-containing composition such that a metal of the metal-containing composition becomes attached or attracted to the coupling agent.

Abstract: An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.

Abstract: A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.

Abstract: This disclosure relates to a system and method for bonding an interconnect to a dense circuit device.

Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Abstract: A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Abstract: A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Abstract: A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.

Abstract: A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.

Abstract: An optical disc of one embodiment of the invention is disclosed that includes a first surface, a second surface, an optically writable label area, and an optically writable data area. The first and the second surfaces are oppositely situated to one another. The label area is on one of the first and the second surfaces. The data area is on one of the first and the second surfaces. The mechanism aids proper focusing of an optical beam of an optical disc device on the optically writable label area and on the optically writable data area.

Abstract: The present invention relates to a carriage for use in a printing device, the carriage including a carriage body with a bearing structure configured to support such carriage body for movement along a reference track. The carriage also includes a printhead anchored to the carriage body, and aligned directly relative to the carriage bearing structure.

Abstract: A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.