Abstract: A heat transfer module, comprises: a heat generating unit and a heat receiving unit which are separated by a gap; a compliant body, having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy that is absorbed in the microscopic voids in the compliant body. Further, the heat transfer module also includes a seal ring in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.

Abstract: A sub-assembly for transferring heat between a heat generating unit and heat receiving unit which are separated by a gap, comprises: a compliant body having microscopic voids therethrough; a liquid metal alloy that is absorbed in the microscopic voids in the compliant body; a seal ring which surrounds the compliant body; and, a retaining member which is attached to the compliant body and the seal ring, and which holds the compliant body spaced apart from the seal ring. This sub-assembly is placed in the gap between the two units and compressed to the point where liquid metal alloy is squeezed out of the compliant body. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.

Abstract: To manufacture I/O terminals on I/O pads of an electronic component, the electronic component, together with a transparent alignment component which has a reference feature, is placed in a fixture such that the I/O pads are seen through the alignment component and a first one of the two components has a fixed position in the fixture. Thereafter, a second one of the two components is moved in the fixture until a particular position is reached where the I/O pads are aligned with the reference feature; and at that particular position the second one of the two components is confined. Subsequently, the alignment component is replaced at its particular position in the fixture, as attained by the above steps, with an opaque template which has a hole pattern that matches and aligns with the I/O pads. Then, the template hole pattern as positioned by the replacing step, is used to fabricate the I/O terminals on the I/O pads.

Abstract: A punch die used to punch minute via holes in ceramic wafers used in integrated circuit construction is created by photoetching holes too small to be mechanically drilled into a pair of thin sheets that sandwich therebetween a thicker spacer slab having somewhat larger, mechanically drilled holes. A multiplicity of punch pins are then pressed into the three-layer sandwich and epoxied thereto to create an inexpensive a punch die which cooperates with a mechanically drilled die plate covered with a punch-pin receiving perforated skin, the holes in which being created in a similar photoetching process.

Abstract: Via holes in a thin planar layer of unfired ceramic which consists essentially of a mixture of an inorganic nonmetallic powder having a high melting temperature and a binder having a lower vaporizing temperature, are formed by the steps of: directing a laser beam, in a sequence, at certain locations on the layer where the via holes are to be formed; controlling the power density in the directed laser beam to a low level at which the binder vaporizes at each of the locations while the powder stays unsintered and unmelted; and removing from the directed laser beam during the above steps, both the vaporized binder and the unbound powder which remains where the binder vaporizes. Preferably, the vaporizing temperature of the binder and the melting temperature of the binder and the melting temperature of the powder are selected such that they differ by at least 200.degree. C.; the power density of the laser is controlled to be between 5 kW/cm.sup.2 and 75 kW/cm.sup.

Abstract: A multichip integrated circuit module includes a ceramic substrate, a plurality of integrated circuit chips mounted on the substrate, and a metal lid which covers the chips and rests on the substrate without attaching to it. Also, the module includes two thin cylindrical members. One cylindrical member surrounds the substrate and makes an airtight solder joint to the substrate's perimeter, while the other cylindrical member surrounds the lid and makes an airtight solder joint to the lid's perimeter. Both cylindrical members run parallel to each other and make an airtight welded joint with each other. When the lid and substrate thermally expand at unequal rates, one thin cylindrical member is deflected by the other member. When a defective chip is replaced, the joint between the two cylindrical members is ground away; and subsequently, the remaining parallel portions of the cylindrical members are rewelded together.

Abstract: An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.

Abstract: An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along a portion of the flat surface of the internal epoxy-glass layer, and then penetrates through it. Conductors lie on the internal epoxy-glass layer including bonding pads on the flat surface portion. After the stack is assembled, the outer epoxy-glass layer and the cavity are covered with an elastic bladder. Subsequently, the stack is laminated by forcing a fluid into the bladder at a temperature and pressure which causes the bladder's membrane to stretch and push against all the surfaces of the cavity. This dams the adhesive from flowing onto the bonding pads.

Abstract: A machine for filling a plurality of via holes in a workpiece comprises a hollow member having an open face; a masking member covering the face and having a plurality of holes which are arranged across the face such that they match the via holes in the workpiece; a diaphragm inside of the hollow member having a front surface that forms a first cavity with the masking member for receiving a high viscosity conductive ink and having a back surface that forms a second cavity with the hollow member; a means for holding the workpiece against the masking member such that their respective holes are aligned; and an orifice in the hollow member for introducing a fluid under pressure into the second cavity and against the back surface of the diaphragm to thereby squeeze a portion of the high viscosity ink through the holes of the masking member and into the holes of the workpiece.