Abstract: A punch and die set include a die with a single large cavity which can receive dry particles of relatively large dimensions or large arching indexes as compared to the transverse dimensions of the tablets formed by the particles, e.g., 1.5 mm diameter and 1 mm height. The upper and lower punches are configured to form an array of interconnected tablets. The punch and dies compress the particles in the die cavity into the array. The tablets are interconnected by an array of links formed by tangential regions of adjacent cylindrical tablets or by links or bridges of finite length, width and thickness dimensions as defined by the punch configurations. The tablets of the arrays are separated by forces created by vibratory or tumbling action. Various embodiments of different shaped tablets and mating punch and die sets are disclosed.