Abstract: The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.

Abstract: A molten metal filter is disclosed having a carbon or carbon-thermite coating that reduces thermal shock to the filter, and protects the filter from corrosion from the metal or components and impurities in the metal, and prevents metal from freezing in the filter. A molten metal assembly suitable for casting molten metal is disclosed which comprises a filter for molten metal and means for molten metal flow passage leading through the filter. The means have surfaces defining a molten metal path. The filter has a coating of carbon or carbon in intimate contact with a thermite material on the surface of the filter. A process is disclosed for filtering molten metal which comprises passing molten metal through the above described coated filter.