Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.

Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.

Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.

Abstract: A device select system according to one embodiment includes an array of first electrical contacts adapted for coupling to a cable; an array of second electrical contacts adapted for coupling to an array of transducers, there being more second electrical contacts than first electrical contacts each of the first electrical contacts being associated with at least two of the second electrical contacts; and a select mechanism for selectively placing each of the first electrical contacts in electrical communication with one of the second electrical contacts associated therewith.

Abstract: Photovoltaic devices are formed with electroplated metal grids that are effectively adhered to the devices. Metal-rich silicides, such as nickel silicides, are formed on the devices by annealing. The metal used in the anneal exhibits low stress. Annealing may be conducted in ambient air followed by removal of oxide and excess metal from the metal-rich silicide. Laser patterning of the antireflective coating of the devices can be used to expose the emitter to form front grid contacts. Doping of the emitter in the patterned region can be increased during laser patterning. The ratio of the centerline to centerline pitch per laser width is controlled to ensure sufficient adhesion of subsequently plated busbars.

Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.

Abstract: A device select system according to one embodiment includes an array of first electrical contacts adapted for coupling to a cable; an array of second electrical contacts adapted for coupling to an array of transducers, there being more second electrical contacts than first electrical contacts each of the first electrical contacts being associated with at least two of the second electrical contacts; and a select mechanism for selectively placing each of the first electrical contacts in electrical communication with one of the second electrical contacts associated therewith.

Abstract: The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.

Abstract: The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.