Abstract: A liquid encapsulated high density integrated circuit package which serves as a complete computer basic system module having both logic and memory circuits in the same package. This unit takes advantage of improvements in the integrated circuit art to minimize the number of physical units required to provide the desired memory capacity while simultaneously maximizing density and thereby minimizing signal path length. Basically the package contains a plurality of stacked semiconductor wafers each of which provides either integrated memory or logic functions. Each semiconductor wafer is mounted on an insulated wafer carrier and is connected to stacking pins around the perimeter of the carrier via a series of radial interconnection which are flexible expansion leads disposed around the outer edge of the wafer. Each wafer is floatation mounted by attaching only its center to the carrier to minimize the stress effects of a thermal expansion mismatch between the wafer, the carrier, and the radial interconnections.