Abstract: A portable computer system comprising a portable computer with a rugged external bay interface. The bay interface facilitates the interchangeability of a variety of electronic device modules. The interface utilizes mechanical and electrical features that promote the use and interchangeability of the modules.

Abstract: A portable computer having an external bay with a multiport connector. The portable computer comprises a base coupled to a display module. The display module has a backcover with a bay area for receiving a variety of electronic device modules.

Abstract: A technique that facilitates the removal of a battery module from a variety of electronic devices, such as portable computers. The technique utilizes a latch having a lifting mechanism that forces the battery module to a lifted position. Upon reaching the lifted position, retention features on the lift mechanism and the battery module engage to hold the battery module in the lifted position. At this lifted position, the battery module is readily gripped and removed.

Abstract: An electronic device having a spill-resistant keyboard. The device utilizes a keyboard having a stiff support layer to which the plurality of keys are mounted. The stiff support layer cooperates with one or more water impermeable layers that reduce or prevent the flow-through of water or other liquids inadvertently spilled over the keyboard.

Abstract: A generic mounting structure is provided between a hard disk drive (HDD) and a computer. The structure includes a plurality of nubs disposed on a brace that can be fitted onto a HDD. The nubs are preferably cylindrical members having an enlarged diameter head. The computer includes, either internally or externally, a bay having a boot interface that closely receives the nubs. The boot interface includes a tapered slotted recess that closely receives the enlarged diameter head of the nubs. In a preferred embodiment, at least two different computer platforms incorporate a substantially identical bay design. Likewise, a brace having nubs oriented in a manner complementary to the bay design is fitted onto at least two different HDDs. Because the HDDs and computer platforms have common mechanical connection by virtue of the brace and bay designs, the HDDs may be exchanged between these computer platforms. In a different embodiment of the present invention, the nubs may be formed directly onto the HDD itself.

Abstract: A generic mounting structure is provided between a hard disk drive (HDD) and a computer. The structure includes a plurality of nubs disposed on a brace that can be fitted onto a HDD. The nubs are preferably cylindrical members having an enlarged diameter head. The computer includes, either internally or externally, a bay having a boot interface that closely receives the nubs. The boot interface includes a tapered slotted recess that closely receives the enlarged diameter head of the nubs. In a preferred embodiment, at least two different computer platforms incorporate a substantially identical bay design. Likewise, a brace having nubs oriented in a manner complementary to the bay design is fitted onto at least two different HDDs. Because the HDDs and computer platforms have common mechanical connection by virtue of the brace and bay designs, the HDDs may be exchanged between these computer platforms. In a different embodiment of the present invention, the nubs may be formed directly onto the HDD itself.

Abstract: An electronic device, such as a portable computer, incorporates a removable cover. The cover is readily removed without tools and provides access to a variety of components that may require servicing, substitution, component upgrades, etc. The component cover utilizes a variety of retention features that provide stability while permitting easy attachment and opening of the cover.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side.