Patents by Inventor Ronald E. Howlett

Ronald E. Howlett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for removing contaminants from solder
    Patent number: 5388756
    Abstract: A method and apparatus allow for continuous removal of contaminants from solder. The solder is pumped from a main solder pot to an auxiliary solder pot through a skimmer valve which is heated to keep the solder molten. In the auxiliary pot, the solder is cooled so that dissolved contaminants such as copper precipitate out and are removed from the pot. The purified solder is then returned to the main pot, for example, by a gravity feed.
    Type: Grant
    Filed: December 27, 1993
    Date of Patent: February 14, 1995
    Assignee: AT&T Corp.
    Inventor: Ronald E. Howlett