Abstract: A method for providing local matching elements for adjusting the characteristic impedance of local transmission line segments to more closely match the input or output impedance of the particular devices to which they couple. The method includes the step of providing a conductive bridge over the active lead of the transmission line, thereby lowering its characteristic impedance. The method can be applied to narrow transmission line segments needed to make contact to small active devices and/or MMIC's and which otherwise exhibit a substantial impedance mismatch with the small elements.

Abstract: The performance of microwave coplanar and other circuit boards is improved by providing local matching elements for adjusting the characteristic impedance of local transmission line segments to better match the input or output impedance of the particular devices to which they couple. This is accomplished by providing a conductive bridge over the active lead of the transmission line, thereby lowering its characteristic impedance. This is very useful for narrow transmission line segments needed to make contact to small active device and/or MMIC's and which otherwise exhibit a substantial impedance mismatch with such small elements.

Abstract: An microwave analog frequency divider capable of ten percent bandwidth at 10 GHz has push-push amplifiers forming an injection locked oscillator. The input frequency f.sub.i is injected at the amplifier reference terminals. The amplifier control terminals are coupled by L's and the reference terminals are coupled by C's and the reference and control terminals form with the L's and C's a resonant circuit tuned approximately to the output frequency f.sub.o =f.sub.i /N, where N is the divisor. Parallel resonant circuits in the f.sub.i injection path have high impedance at f.sub.o to prevent loading of the oscillator. A control device in the f.sub.i injection path turns the oscillator on when f.sub.i is present and off when f.sub.i is absent. Matching networks are included at input, output and between the control device and the oscillator to obtain efficient operation.

Abstract: A miniature microstrip dipole antenna is constructed on a high permitivity dielectric substrate for compactibility with microwave monolithic integrated circuit (MMIC) technology. The antenna comprises two dipole arms coupled to opposite faces of the substrate. The dipole arms are coupled to a microstrip transmission line through a tapered balun. The tapered balun comprises two conductors on opposite faces of the substrate which are coupled to corresponding dipole arms. The conductors are separated laterally (with respect to the width of the face of the substrate) a calculated distance, and are gradually tapered. This allows the balun to efficiently transform unbalanced signals at the microstrip transmission line to balanced signals at the plurality of dipole arms. Alternatively, the balun allows balanced signals at the dipole arms to be efficiently transformed to unbalanced signals at the microstrip transmission line.

Abstract: A wide band tunable microwave oscillator for monolithic microwave integrated circuits. The oscillator does not use varactors or inductors for oscillation, but uses a voltage variable resistor coupled to a first MESFET supplying a capacitance, and to an amplifying element to create an RC oscillator. The voltage variable resistor is a second MESFET coupled to a variable voltage source. The oscillator takes advantage of the gate capacitance of the first MESFET, as well as the gain available from using an active element within the feedback loop.

Abstract: A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. A substrate having a bi-metallic cladding on one side of the substrate and a conductive metallic cladding on an opposing side of the substrate is used. A predetermined trace pattern is formed in the metallic cladding. Resistive elements are formed in the bi-metallic cladding opposing their desired locations in the trace pattern. The bi-metallic cladding consists of a resistive layer between the substrate and a second conductive layer. Tabs are etched in the second conductive layer, then resistors, which couple various tabs together, are etched in the resistive layer. Plated holes connect the tabs to desired locations in the trace pattern located on the opposing side of the substrate.