Abstract: A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers.

Abstract: A nozzle for use with a thick film dispensing system comprising a hollow tubular member having a fluid receiving port at one end and a fluid dispensing orifice at the other end. The hollow tubular member has a means coupled thereto for spacing and maintaining the fluid dispensing orifice a preselected distance away from a substrate surface. The use of this nozzle permits the uniform cross-section dispensing of a viscous thick film fluid on the substrate surface regardless of the curvature thereof.