Abstract: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.

Abstract: A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and adapted to attach a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system also includes a laser cleaning mechanism mounted to the frame, the laser cleaning mechanism including a laser for emitting laser light adapted to irradiate contaminants on a bonding pad, the laser mechanism located on the frame so as to emit light onto a bonding pad of at least one of the semiconductor device and the substrate prior to the bonding head attaching the wire thereto.