Abstract: An ultrasonic jet semiconductor wafer cleaning method and apparatus for removing debris from a surface of a semiconductor wafer as the wafer is rotated about a prescribed axis in a cleaning plane whereby a housing having a principal axis, an inlet port, and an outlet port is provided. The method further includes producing focused ultrasonic waves of acoustic energy concentric with and incident the outlet port to form a jet stream of cleaning liquid released through the outlet port; adjustably positioning a focal point of the focused ultrasonic waves between a first focal point position and a second focal point position along an axis; and sweeping the housing in an reciprocating manner along a sweep path.

Abstract: An ultrasonic jet semiconductor wafer cleaning apparatus for removing debris from a surface of a semiconductor wafer as the wafer is rotated about a prescribed axis in a cleaning plane is disclosed. The apparatus comprises a housing having a principal axis, an inlet port, and an outlet port; a means for producing focused ultrasonic waves of acoustic energy concentric with and incident the outlet port to form a jet stream of cleaning liquid released through the outlet port; a focal point positioning means for adjustably positioning a focal point of the focused ultrasonic wave producing means between a first focal point position and a second focal point position along an axis; and a means coupled to the housing for sweeping the housing in an reciprocating manner along a sweep path.