Abstract: A solar boiler 300 includes first and second primary receiver panels 500, 600 spaced apart by a gap 700. Each panel 500, 600 include a plurality of primary boiler tubes 510, 610 for receiving solar flux. The boiler 300 includes at least one secondary receiver arrangement 800 disposed across the gap 700 for receiving solar flux incident thereacross. The arrangement 800 includes at least one secondary boiler tube 810, and at least one support member 820 supported thereto. The arrangement 800 is configured relative to the primary panels 500, 600 such that endmost primary boiler tubes 510a, 610a are supported over the support member 820 in spaced relation ‘S’ to the secondary boiler tube 810 for enabling transverse and lateral thermal expansion of the tubes 510, 610, 810 without bending out. Further, a panel joining attachment 900 is provided for attaching the panels 500, 600 and the arrangement 800.

Abstract: In a solar receiver arrangement 300 with a support structure 600, the support structure 600 includes a plurality of tie members 700 for tangentially coupling a plurality of tubes 510, for forming at least one receiver panel 500, in such a manner that the at least one tie member 700 is coupled in at least one crotch portion 520 between a pair of tubes 510. The support structure 600 further includes a plurality of panel support members 800 coupled to the receiver panel 500 selectively in at least one crotch portion 520 between a pair of tubes 510. Furthermore, at least one latching member 900 is configured to detachably attach the plurality of panel support members 800 for engaging the plurality of receiver panels 500.

Abstract: A solar boiler 300 includes first and second primary receiver panels 500, 600 spaced apart by a gap 700. Each panel 500, 600 include a plurality of primary boiler tubes 510, 610 for receiving solar flux. The boiler 300 includes at least one secondary receiver arrangement 800 disposed across the gap 700 for receiving solar flux incident thereacross. The arrangement 800 includes at least one secondary boiler tube 810, and at least one support member 820 supported thereto. The arrangement 800 is configured relative to the primary panels 500, 600 such that endmost primary boiler tubes 510a, 610a are supported over the support member 820 in spaced relation ‘S’ to the secondary boiler tube 810 for enabling transverse and lateral thermal expansion of the tubes 510, 610, 810 without bending out. Further, a panel joining attachment 900 is provided for attaching the panels 500, 600 and the arrangement 800.

Abstract: In a solar receiver arrangement 300 with a support structure 600, the support structure 600 includes a plurality of tie members 700 for tangentially coupling a plurality of tubes 510, for forming at least one receiver panel 500, in such a manner that the at least one tie member 700 is coupled in at least one crotch portion 520 between a pair of tubes 510. The support structure 600 further includes a plurality of panel support members 800 coupled to the receiver panel 500 selectively in at least one crotch portion 520 between a pair of tubes 510. Furthermore, at least one latching member 900 is configured to detachably attach the plurality of panel support members 800 for engaging the plurality of receiver panels 500.

Abstract: It has now been found that these and other objects of the invention may be attained in a vapor generation apparatus which includes a tube wall and an elongated first horizontal buckstay disposed at a first elevation. The apparatus also includes coupling means coupling the first horizontal buckstay to the tube wall, an elongated second horizontal buckstay disposed at an elevation that is higher than the first elevation. The apparatus also includes means for coupling the second horizontal buckstay to the tube wall. A first elongated vertical buckstay member has first and second ends and also includes for securing one end of the first elongated vertical buckstay members to one of the horizontal buckstay members.

Abstract: A vapor generation apparatus which includes a furnace, having a tube wall and at least one vertical buckstay member disposed proximate to the outer face of the spiral tube wall. The apparatus includes a stirrup for transmitting forces between the spiral tube wall and the vertical buckstay member. The stirrup includes a U-shaped plate and a cylindrical member, apparatus for mounting the cylindrical member on the vertical buckstay member including first and second lugs fixed to the vertical buckstay member in spaced relationship. The cylindrical member is fixed between the first and second lugs in spaced relation to the vertical buckstay member. The apparatus also includes apparatus for mounting the U-shaped plate on the tube wall.

Abstract: A tube stop for cooperation with a tube and fin furnace wall and a horizontal buckstay which includes first and second generally parallel generally planar spaced plates, apparatus for attachment of the first and second generally parallel generally planar spaced plates to the associated tube wall. A U-shaped plate has first and second opposed generally planar generally parallel space side walls, the first and second side walls being respectively disposed in spaced relation generally parallel relationship to the first and second generally parallel generally planar spaced plates, apparatus for coupling the first and second walls of the U-shaped member respectively to the first and second generally parallel generally planar spaced plates, and apparatus for rigidly coupling the U-shaped plate to the to the associated horizontal buckstay.

Abstract: A corrosion resistant electrical interconnect system has a flexible circuit with buried conductor patterns in an insulative film coating which is juxtaposed to a feed-through connector having inlet/outlet electrical contact pins therethrough. Sharp ends are present on the pins which pierce the insulative film and permit spot welding of the pin tips to portions of the conductor pattern. Other portions of the conductor pattern extend exteriorly of the flexible circuit and are electrically connected on to bond pads of an integrated circuit chip such as a sensor chip utilized in a mass flow meter.