Patents by Inventor Ronald G. Pofahl

Ronald G. Pofahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate
    Patent number: 6015722
    Abstract: The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: January 18, 2000
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Donald R. Banks, Ronald G. Pofahl, Mark F. Sylvester, William G. Petefish, Paul J. Fischer
  • Method for assembling an integrated circuit chip package having at least one semiconductor device
    Patent number: 5970319
    Abstract: The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: October 19, 1999
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Donald R. Banks, Ronald G. Pofahl, Mark F. Sylvester, William G. Petefish, Paul J. Fischer
  • Method for assembling an integrated circuit chip package having at least one semiconductor device
    Patent number: 5919329
    Abstract: The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.
    Type: Grant
    Filed: October 2, 1998
    Date of Patent: July 6, 1999
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Donald R. Banks, Ronald G. Pofahl, Mark F. Sylvester, William G. Petefish, Paul J. Fischer