Patents by Inventor Ronald Gampp

Ronald Gampp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micromechanical component and method for manufacturing such a component
    Patent number: 7667282
    Abstract: A method and a micromechanical component which counteract manufacturing-process-related mechanical stresses in the membrane are provided. The membrane is formed on a substrate in a layer system and spans a cavity in the substrate. The layer system includes at least one base layer formed on the substrate for circuit elements. At least one structured masking layer is also formed on the base layer for defining the circuit elements. The masking layer is structured in the area of the membrane in such a way that mechanical stresses acting in the area of the membrane under vacuum are at least partially compensated, the intrinsic stress of the masking layer being taken into account in the layout of the structuring.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: February 23, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Joerg Muchow, Torsten Ohms, Volkmar Senz, Guenther-Nino-Carlo Ullrich, Ronald Gampp
  • Micromechanical component and method for manufacturing such a component
    Publication number: 20060021961
    Abstract: A method and a micromechanical component which counteract manufacturing-process-related mechanical stresses in the membrane are provided. The membrane is formed on a substrate in a layer system and spans a cavity in the substrate. The layer system includes at least one base layer formed on the substrate for circuit elements. At least one structured masking layer is also formed on the base layer for defining the circuit elements. The masking layer is structured in the area of the membrane in such a way that mechanical stresses acting in the area of the membrane under vacuum are at least partially compensated, the intrinsic stress of the masking layer being taken into account in the layout of the structuring.
    Type: Application
    Filed: July 21, 2005
    Publication date: February 2, 2006
    Inventors: Joerg Muchow, Torsten Ohms, Volkmar Senz, Guenther-Nino-Carlo Ullrich, Ronald Gampp