Patents by Inventor Ronald H. Cox

Ronald H. Cox has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fine pitch system and method for reinforcing bond pads in semiconductor devices
    Patent number: 6818540
    Abstract: A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: November 16, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Mukul Saran, Charles A. Martin, Ronald H. Cox
  • Fine pitch system and method for reinforcing bond pads in semiconductor devices
    Publication number: 20020187634
    Abstract: A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
    Type: Application
    Filed: July 23, 2002
    Publication date: December 12, 2002
    Inventors: Mukul Saran, Charles A. Martin, Ronald H. Cox
  • Fine pitch system and method for reinforcing bond pads in semiconductor devices
    Patent number: 6448650
    Abstract: A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: September 10, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Mukul Saran, Charles A. Martin, Ronald H. Cox
  • FINE PITCH SYSTEM AND METHOD FOR REINFORCING BOND PADS IN SEMICONDUCTOR DEVICES
    Publication number: 20020089062
    Abstract: A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
    Type: Application
    Filed: May 14, 1999
    Publication date: July 11, 2002
    Inventors: MUKUL SARAN, CHARLES A. MARTIN, RONALD H. COX