Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

Abstract: Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.

Abstract: A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

Abstract: A method for manufacturing a multilayer structure, includes obtaining a first substrate film for accommodating electronics, said first substrate film having a first side and an opposite second side, said first substrate film including electrically substantially insulating material, said first substrate film preferably being formable and/or thermoplastic, providing, optionally by mounting and/or by printed electronics technology, circuitry on at least said second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film, and molding, optionally by injection molding or reactive molding, plastic material on the first side of the first substrate film so as to at least partially cover it.

Abstract: Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.

Abstract: A drive assembly for a vehicle door, comprising: a motor having a driving member; a housing having a shaft rotatably received therein; an input member being rotatably received upon the shaft, the input member being operatively associated with the driving member, wherein rotation of the driving member causes rotation of the input member; an armature mounted on the input member; a rotor fixedly secured to the shaft, the rotor being cylindrical in shape and has a plurality of teeth positioned along the periphery of the rotor, the teeth being positioned in an equidistant manner; a coil mounted to the housing, the coil providing magnetic flux lines through the rotor to attract the armature when the coil is energized; and an inductance sensor assembly mounted to the housing in a facing spaced relationship with respect to the plurality of teeth of the rotor, wherein rotational speed and direction of the rotor is detected by the inductance sensor assembly.

Abstract: A non-contact detection system and method for detecting obstructions in relation to a powered door on a vehicle such that contact with the door may be prevented. The detection system includes an object detection sensor located on the powered door for sensing an object within an adjustable sensing zone. A door position sensor senses position of the door relative to at least one of an open and closed door position. A controller adjusts the sensing zone of the object detection sensor as a function of the sensed door position.

Abstract: Provided for herein is a method of making a heated steering wheel, comprising depositing an electrically conductive layer on at least a portion of a steering wheel substrate to produce thereon a heating element for receiving an electrical current and providing a source of heat. Also disclosed is a heating element for a steering wheel and a heated steering wheel assembly formed using this method.

Abstract: The present invention comprises a rigid, one-piece, lightweight, plastic and/or resin cover housing structure designed to accommodate and protect an outdoor barbecue grill positioned within. The shape of the grill covering allows for the shape of an outdoor grill and further allows for convenient use and storage. Furthermore, the grill covering provides additional food service and/or preparation space, and an apparatus whereby cooking utensils can be stored.