Abstract: This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

Abstract: A plastic substrate is provided, on which is disposed a sacrificial polymer layer and a thin metal film over the sacrificial polymer layer. The thin metal film is laser-delamination patterned. The sacrificial polymer layer is at least partially removed via laser delamination where the thin metal film has been removed via laser delamination.

Abstract: A method comprising adjusting a first relative position between a substrate and a fabrication unit by a first shift value, forming a first pattern relative to a first pattern instance on the substrate subsequent to adjusting the first relative position by the first shift value, and calculating a second shift value using a first displacement between the first pattern and the first pattern instance and a second displacement between a second relative position of the first pattern instance with respect to a second pattern instance is provided.

Abstract: Systems and methods for forming templates for trace or circuit deposition are described. Specifically, a method of forming a template for trace or circuit deposition can comprise steps of jetting an ink-jettable composition onto a substrate in a predetermined pattern, wherein the ink-jettable composition includes a liquid vehicle and at least one coupling agent dispersed therein. The substrate can include functional groups interactive with the coupling agent, wherein upon contact between the coupling agent and the substrate after the jetting step, the coupling agent becomes attached or attracted to the substrate. The method can also include the step of contacting the coupling agent with a metal-containing composition such that a metal of the metal-containing composition becomes attached or attracted to the coupling agent.

Abstract: An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.

Abstract: A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.

Abstract: This disclosure relates to a system and method for bonding an interconnect to a dense circuit device.

Abstract: A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.