Patents by Inventor Ronald Hutton

Ronald Hutton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive metal-filled composites via developing agents
    Patent number: 5173519
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: January 7, 1991
    Date of Patent: December 22, 1992
    Assignee: Akzo N.V.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald Hutton