Patents by Inventor Ronald I. Spreitzer

Ronald I. Spreitzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit interconnect
    Patent number: 6794760
    Abstract: A system may include an integrated circuit die, a package, and an interconnect. The integrated circuit die may include a conductive die pad, the package may include a conductive package pad, and the interconnect may include two or more stranded wires. A first end of the interconnect is electrically coupled to the conductive die pad, and a second end of the interconnect is electrically coupled to the package pad.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: September 21, 2004
    Assignee: Intel Corporation
    Inventors: Edward Jaeck, Ronald I. Spreitzer, Robert M. Nickerson, Lesley A. Polka