Patents by Inventor Ronald Irsigler

Ronald Irsigler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080029850
    Abstract: A method of fabricating an electrical contact through a through hole in a substrate, wherein the through hole is at least in part filled with a liquid conductive material and the solidified liquid conductive material provides an electrical contact through the through hole.
    Type: Application
    Filed: May 7, 2007
    Publication date: February 7, 2008
    Applicant: QIMONDA AG
    Inventors: Harry Hedler, Ronald Irsigler, Volker Lehmann, Judith Lehmann, Thorsten Meyer, Octavio Trovarelli