Abstract: A measurement system employs a method and apparatus for uniquely tagging each of a plurality of transducers, automatically recognizing the tag for identifying the transducer and automatically adjusting electronic parameters of the system for enhancing performance with a selected transducer. In a preferred embodiment, a resistor is inserted in a piezoelectric transducer of an ultrasonic thickness gauge, a current source and A to D converter measure the resistor and a microprocessor-based logic system adjusts measurement parameters of the gauge to be automatically optimized for the associated transducer characteristics.

Abstract: A non-destructive bond testing apparatus utilizes impedance variation represented by both the phase and amplitude of the signal vector response of a sonic energy generating and receiving probe, which is applied to a laminar, honeycomb or fiber composite structure under test. Typical bonding methods for which this bondtester and method are applicable include adhesive bonding, diffusion bonding, brazing, resistance and impact/friction bonding. A cathode ray tube displays the tip of the vector (as a bright dot) which represents the impedance characteristic affected by the structure under test.