Abstract: A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.

Abstract: A burn-in apparatus for burning-in or testing at least one device-under-test (DUT) that is mounted on a burn-in-board comprising a chamber, a board support affixed within the chamber so as to support a burn-in board in an installed position, a blower for creating a circulating gas flow in the chamber, a heat exchanger that removes heat generated during burn-in, and at least one gas flow linearizer upstream of the board support in the circulating gas flow. The linearizer has a first axis substantially parallel to the circulating gas flow and is at least of sufficient length in the direction of the first axis to substantially linearize the circulating gas flow in the vicinity of the installed burn-in board.

Abstract: A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.