Abstract: An array of gas sensor device packages comprises a plurality of gas sensor device packages, each gas sensor device package comprising a lead frame including bond pads and at least one gas sensor die in electrical communication with the bond pads. The array further comprises a protective covering over the plurality of gas sensor device packages. Related gas sensor device packages and arrays and methods of forming the arrays are also disclosed.

Abstract: A method and system are provided for increasing the accuracy of AC parametric testing. The invention provides a method of precisely estimating signal propagation delay time in an integrated circuit testing apparatus, wherein a plurality of signal propagation delay time measurements are taken and additional delay times are estimated by linearly interpolating the measured delays. A desired test point (desired output voltage at a given time) is established. Using a sample device, a slope is established on a time vs. voltage plot for a line through the desired test point. Where a desired test point falls between strobe times on a tester, linear extrapolation is used to calculate what voltages must be tested for at the two bracketing strobe times in order to guarantee the desired performance at the desired test point. One or more devices are then tested for the calculated voltages at the corresponding bracketing strobe times.

Abstract: A method and software apparatus for implementing a dynamically modifiable test flow for integrated circuit devices that adapts to the characteristics of each processed device lot. A modified set of tests sufficient to ensure proper device function for a particular lot is performed, reducing test costs and increasing test capacity. The method and system of the invention periodically samples a predetermined sample number of devices using a full set of tests including a set of skippable tests. Depending upon the performance characteristics of the sample device group on the skippable tests, a number of skippable tests are skipped during a modified test flow. After a next set of devices is tested using the modified test flow, the full set of tests is again performed on another sample group, and the size and makeup of the modified test flow is adjusted according to the new results.

Abstract: A method and system are provided for increasing the accuracy of AC parametric testing. The invention provides a method of precisely estimating signal propagation delay time in an integrated circuit testing apparatus, wherein a plurality of signal propagation delay time measurements are taken and additional delay times are estimated by linearly interpolating the measured delays. A desired test point (desired output voltage at a given time) is established. Using a sample device, a slope is established on a time vs. voltage plot for a line through the desired test point. Where a desired test point falls between strobe times on a tester, linear extrapolation is used to calculate what voltages must be tested for at the two bracketing strobe times in order to guarantee the desired performance at the desired test point. One or more devices are then tested for the calculated voltages at the corresponding bracketing strobe times.

Abstract: A method and software apparatus are provided for implementing a dynamically modifiable test flow for integrated circuit devices that adapts to the characteristics of each processed device lot. According to the method of the invention, a modified set of tests sufficient to ensure proper device function for a particular lot is performed, reducing test costs and increasing test capacity. The method and system of the invention periodically samples a predetermined sample number of devices using a full set of tests including a set of skippable tests. Depending upon the performance characteristics of the sample device group on the skippable tests, a number of skippable tests are skipped during a modified test flow. After a next set of devices is tested using the modified test flow, the full set of tests is again performed on another sample group, and the size and makeup of the modified test flow is adjusted according to the new results.

Abstract: A method and system are provided for increasing the accuracy of AC parametric testing. The invention provides a method of precisely estimating signal propagation delay time in an integrated circuit testing apparatus, wherein a plurality of signal propagation delay time measurements are taken and additional delay times are estimated by linearly interpolating the measured delays. A desired test point (desired output voltage at a given time) is established. Using a sample device, a slope is established on a time vs. voltage plot for a line through the desired test point. Where a desired test point falls between strobe times on a tester, linear extrapolation is used to calculate what voltages must be tested for at the two bracketing strobe times in order to guarantee the desired performance at the desired test point. One or more devices are then tested for the calculated voltages at the corresponding bracketing strobe times.

Abstract: A method is described for testing the programming function of integrated circuit device cells including floating gate elements. To accelerate the testing process, at most two programming pulses are needed, the two pulses being applied with the device at minimum and maximum power supply voltage levels specified for the device. First, the cell state after an initial programming pulse with the device at a minimum power supply voltage level, tested against a minimum reference voltage level, indicates whether the cell is programming properly. If not, testing ceases immediately and the device is rejected after the first pulse. Devices passing the first reading after the first pulse are subjected to a second reading at the target (higher) reference voltage. Devices passing after the second reading are designated as passing and are subjected to the next test in the test flow.

Abstract: A novel test procedure is used to determine the optimum programmable charge pump levels for a flash memory array in a CPLD. According to the method of the invention, an automated tester steps through all combinations of charge pump codes and attempts to program the flash memory with each combination of voltage levels. For each combination, the results of the test (pass or fail) are logged and stored into a map or array. The center of a window of passing pump codes is taken as the starting reference point. The next step is to verify the actual voltage level associated with the pump code combination corresponding to the starting reference point. The reference pump code is loaded into the device and the corresponding flash memory cell voltage levels are measured. If the measured voltage level does not fall into the preferred range, the tester automatically adjusts the level towards the preferred range by adjusting the pump codes.

Abstract: A programmable logic device (PLD) includes test circuitry compatible with the JTAG standard (IEEE Standard 1149.1). The PLD also includes a programmable JTAG-disable bit that can be selectively programmed to disable the JTAG circuitry, leaving the PLD to operate as a conventional, non-JTAG-compatible PLD. The PLD also includes means for testing the JTAG test circuitry to determine whether the JTAG circuitry is defective, and means for programming the JTAG-disable bit to disable the JTAG circuitry if the testing means determines that the JTAG circuitry is defective.

Abstract: A method is provided which includes on-chip identification of individual die. The first wafer sort includes the steps of programming a plurality of dice on a wafer, programming predetermined memory memory cells on each good die to identify the wafer on which that die is located, and storing the location of each good die in a file created for each wafer. Then, the plurality of dice are subjected to predetermined conditions. In the second wafer sort, predetermined memory cells on one die are accessed to determine the associated file of that die. The associated file is then loaded. Finally, the good dice are tested. In another embodiment, the first wafer sort includes identifying the first good die on the wafer. After the next good die on the wafer is found, that die is programmed to indicate the location of the proceeding good die. This programming step is repeated until the last good die on the wafer is programmed. Once again, the wafer is subjected to adverse conditions.