Abstract: The invention relates to an electroplating solution for providing a deposit of an alloy of gold and tin. This solution includes an aqueous solvent in which gold is present in the form of a solution soluble cyanide complex and tin is present in the form of a solution soluble organotin complex. 2,2?-dipyridyl is present as an additive that allows the codeposition of useful gold-tin alloy compositions at current densities lower than would be possible in its absence, given the concentrations of the individual metallic components in the solution. This additive is generally used at a concentration of 0.1 to 1 grams per liter for imparting significant enhancements in providing gold-tin alloy deposits.

Abstract: The invention relates to an electroplating solution for providing a deposit of an alloy of gold and tin. This solution includes an aqueous solvent in which gold is present in the form of a solution soluble cyanide complex and tin is present in the form of a solution soluble organotin complex. 2,2′-dipyridyl is present as an additive that allows the codeposition of useful gold-tin alloy compositions at current densities lower than would be possible in its absence, given the concentrations of the individual metallic components in the solution. This additive is generally used at a concentration of 0.1 to 1 grams per liter for imparting significant enhancements in providing gold-tin alloy deposits.

Abstract: Disclosed are cyanide free electroplating solutions for gold or alloys thereof; said solutions comprising gold in the form of a soluble sulfite complex, an added source of sulfite and/or bisulfite ion and a supporting electrolyte; and said solutions further comprising both an organic polyamine or mixture of polyamines of molecular weight from about 60 to 50,000, and an aromatic organic nitro compound; wherein the pH of said solutions is below about 6.5.

Abstract: Electroplating solutions for the deposition of palladium or the alloys thereof, in which solutions palladium was added in the form of the reaction product of palladium diaminodinitrite with an acid in the presence of a scavenging agent for nitrous acid.

Abstract: A palladium electroplating solution containing the palladium in the form of a soluble organopalladium complex of an inorganic palladium salt, an organic polyamine complexing agent, a cyclic imide and a nitrogen containing heterocyclic compound having a six-membered ring.

Abstract: A palladium electroplating solution contains the palladium in the form of a soluble organopalladium complex of an inorganic palladium salt and an organic polyamine complexing agent. The solution also preferably contains an imide and free complexing agent.

Abstract: Bright gold or gold alloy electroplating employing a preformed fully neutralized salt of a cobalt or nickel metal organophosphorus chelate as the brightening agent.

Abstract: Electroplating bath for the electrodeposition of tin-nickel alloys, approximating 65% by weight of tin and 35% by weight of nickel, said alloy being deposited over a wide range of current density, from a bath consisting essentially of (i) nickel sulfamate concentrate sufficient to give about 10 ounces of nickel per gallon, and (ii) ammonium bifluoride to the amount of about 1 pound per gallon, and (iii) stannous fluoride sufficient to give about 4 ounces of tin metal per gallon.The bath is strongly self-buffered to a pH 4.3 to 4.5, but operable in the pH range of 4.0 to 5.5.Said bath is operable to place the said amount of tin and nickel at any temperature about 60.degree. C at a current density from 0 up to and exceeding 40 amperes per square foot when temperature is in the range of 74.degree. to 77.degree. C.The deposit is bright, of low compressive stress, and exhibits an extraordinary resistance to corrosion.