Abstract: The present invention is directed to a network communication system that provides textual communication and call transferring between nodes. The system further allows simultaneous notification of multiple nodes of an incoming call. The system includes a local computer that may also serve as a node in the system. A call may originate with the local computer or be generated by a remote device that is in communication with the local computer. The local computer generates a call indicator that is transmitted to one or more nodes simultaneously. Selection of the nodes may be based on user intervention or by predefined groupings. Each node receiving a call indicator is configured to generate a ring message in response. The ring message is displayed on an output device to alert a node user to the incoming call. In response to the ring message, a node user may choose to accept or decline the call. A node user's responses to the call indicator are transmitted to the local computer.

Abstract: The present invention is directed to a network communication system that provides textual communication and call transferring between nodes. The system further allows simultaneous notification of multiple nodes of an incoming call. The system includes a local computer that may also serve as a node in the system. A call may originate with the local computer or be generated by a remote device that is in communication with the local computer. The local computer generates a call indicator that is transmitted to one or more nodes simultaneously. Selection of the nodes may be based on user intervention or by predefined groupings. Each node receiving a call indicator is configured to generate a ring message in response. The ring message is displayed on an output device to alert a node user to the incoming call. In response to the ring message, a node user may choose to accept or decline the call. A node user's responses to the call indicator are transmitted to the local computer.

Abstract: A communication system allows a remote user to access a web site across a PSTN using a conventional text device such as a TTY device. The web site is configured with text, menu options, and communication transfer capabilities as may be found in an automated telephone service. The system includes a text gateway module in electrical communication with the text device. The text gateway module receives text data generated by the text device and directs the text data to a text/web translator. The web/text translator converts the text data into web data suitable for use by a web site and server. The web/text translator transmits the web data to a web gateway module that directs the web data to a specified web site. The web/text translator further receives from the web gateway module web data generated by the web site. The web/text translator converts the web data to text data which is readable by the text device. The text data is then transmitted to the text gateway module and then passed to the text device.

Abstract: A network communications system containing one or more nodes includes an ITU/TDD/VOICE modem in electrical communication with a local computer. A remote device connecting to the ITU/TDD/VOICE modem is able to converse in real time using textual characters with the local computer user. Once connected to the ITU/TDD/VOICE modem, the remote device is recognized by the network as an additional node. If the remote device wishes to textually communicate with a node on the network, the local computer formats the data into a network compatible format for transmission to the node. The local computer transmits the data to the node while communication between the ITU/TDD/VOICE modem and the remote device is maintained. Once the remote device is connected to the network, the network may treat the remote device as an additional node. Thus, the remote device may be privileged to some or all of the network services.

Abstract: Portable communication equipment having a virtual display including display electronics and optics for providing a virtual image in the display, a virtual control panel image viewable in the virtual display as a portion of the virtual image and cursor electronics connected to the display electronics for producing a manually controllable cursor virtual image in the display. The virtual image control panel is connected to be operable with the cursor virtual image and further connected to operate the portable communication equipment. Manual controls, connected to the cursor electronics for controlling the position and function of the cursor virtual image, are mounted on the portable communication equipment and externally accessible by an operator.

Abstract: A modem system includes an ITU/TDD/VOICE modem or other modem that is connected to a local computer and a telephone line. The ITU/TDD/VOICE modem allows transmission and reception of ITU, TDD, and voice signals over the telephone line to and from a remote device (such as a remote TDD, ITU modem, or telephone). The modem system may include one or more of the following features. The modem system may be used in a network whereby an indicator on a display screen indicates sound energy received by the modem over the line. The modem system may allow speed jumps from one speed to another during a call. The modem system includes a display in which the screen is split into two vertical areas, to display text sent between remote computers. The text sent by one computer is displayed in the right vertical area, while the text of the other computer is displayed in the left area. The vertical placement of the texts are based on the relative time in which they were sent to the other person.

Abstract: An integrated electro-optical package (50) including a first light emitting device (LED) display chip (28) and at least one additional LED display chip (30), each composed of an optically transparent substrate (10) with an array (15) of LEDs (12) formed thereon and cooperating to generate a complete image. The LEDs (12) of the first LED display chip (28) are constructed to emit light of a wavelength different than the light emitted by the additional LED display chip(s) (30), thereby creating a different color menu or object bar (156) within the view (150) generated. A mounting substrate (25), having connection pads (32), bump bonded to the pads on the optically transparent substrate (10). A driver substrate (55) having connections to the pads (32) on the mounting substrate (25). A plurality of driver and control circuits (57) connected to the LED display chips (28) and (30) through electrodes on the driver substrate (55).

Abstract: An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

Abstract: A communication system includes an ITU/TDD/VOICE modem that is connected to a local computer and a telephone line. The ITU/TDD/VOICE modem allows transmission and reception of ITU, TDD, and voice signals over the telephone line to and from a remote device. Examples of remote devices include a remote TDD or ITU modem (which connects to a remote computer), or a telephone. The ITU/TDD/VOICE modem may operate in various modes including (1) a computer communications mode and (2) a stand alone mode. During computer communications mode, the ITU/TDD/VOICE modem is controlled by the local computer. During stand alone mode, the ITU/TDD/VOICE modem operates independently of the local computer. The stand alone mode may further include an answering machine mode and prestored outgoing message mode.

Abstract: An integrated electro-optical package including an optically transparent substrate with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the substrate. A driver substrate having mounting pads, bump bonded to the pads on the substrate. A plurality of driver circuits connected to the light emitting devices through terminals on the driver substrate. A lens mounted to the substrate over the array of light emitting devices and on a side opposite to magnify the real image and produce an easily viewable virtual image.

Abstract: An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

Abstract: A waveguide virtual image display including image generation apparatus providing a real image at an inlet of an optical waveguide. The real image being reflected a plurality of times within the optical waveguide by diffractive optical elements that magnify and filter the real image and produce a virtual image at a viewing aperture. The display is mounted on an eyeglasses frame for hands-free viewing.

Abstract: In the fabrication of buried heterostructure InP/InGaAsP lasers, mask undercutting during the mesa etching step is alleviated by a combination of steps which includes the epitaxial growth of a large bandgap InGaAsP cap layer (1.05 eV.ltorsim.E.sub.g .ltorsim.1.24 eV) and the plasma deposition of a SiO.sub.2 etch masking layer. Alternatively, the cap layer may be a bilayer: an InGaAs layer or narrow bandgap InGaAsP (E.sub.g .ltorsim.1.05 eV), which has low contact resistance, and a thin InP protective layer which reduces undercutting and which is removed after LPE regrowth is complete. In both cases, etching at a low temperature with agitation has been found advantageous.

Abstract: Thermal degradation of compound single crystal substrates (e.g., InP) containing a relatively volatile element (e.g., P) prior to LPE growth has been virtually eliminated by an improved protection technique. A partial pressure of the volatile element is provided by a solution (e.g., Sn-In-P) localized inside a chamber which is external to the LPE boat and which surrounds substrate prior to growth, thereby preventing thermal damage to the substrate surface. Applicability of the technique to other epitaxial growth processes (e.g., VPE and MBE) is also discussed.

Abstract: In the fabrication of buried heterostructure InP/InGaAsP lasers, mask undercutting during the mesa etching step is alleviated by a combination of steps which includes the epitaxial growth of a large bandgap InGaAsP cap layer (1.05 eV.ltorsim.E.sub.g .ltorsim.1.24 eV) and the plasma deposition of a SiO.sub.2 etch masking layer. Alternatively, the cap layer may be a bilayer: an InGaAs layer or narrow bandgap InGaAsP (E.sub.g .ltorsim.1.05 eV), which has low contact resistance, and a thin InP protective layer which reduces undercutting and which is removed after LPE regrowth is complete. In both cases, etching at a low temperature with agitation has been found advantageous.

Abstract: Thermal degradation of compound single crystal substrates (e.g., InP) containing a relatively volatile element (e.g., P) prior to LPE growth has been virtually eliminated by an improved protection technique. A partial pressure of the volatile element is provided by a solution (e.g., Sn-In-P) localized inside a chamber which is external to the LPE boat and which surrounds substrate prior to growth, thereby preventing thermal damage to the substrate surface. Applicability of the technique to other epitaxial growth processes (e.g., VPE and MBE) is also discussed.

Abstract: Discrete InP-InGaAsP mesa double heterostructure lasers have been fabricated by a batch process in which the laser mirrors are formed by chemically etching the wafer from the top surface down into the substrate. A feature of the process is that the metal contact on the top surface is recessed within the periphery of an overlying mask, and the etching time is controlled so that the contact is not undercut by the sidewalls of the mesa. Another feature is the use of a self-limiting etchant which etches the mirrors smoothly and at a faster rate than the sidewalls. Preferably, the mirrors etch isotropically and the sidewalls etch preferentially along crystallographic planes. Also described is subsequent batch processing (e.g., forming mirror coatings) and on-wafer testing of the etched-mirror lasers.

Abstract: Semiconductor devices using chemically treated n-type GaAs have greatly reduced surface recombination velocities. A preferred embodiment uses fractional monolayers of ruthenium on the GaAs surface.