Patents by Inventor Ronald J. Seaman

Ronald J. Seaman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a multipad solder preform
    Patent number: 4774760
    Abstract: A solder preform and technique for making same is disclosed for use in a one time flux process for attaching electronic modules to printed circuit substrates via plated through holes or surface mount pads.
    Type: Grant
    Filed: October 9, 1987
    Date of Patent: October 4, 1988
    Assignee: International Business Machines Corporation
    Inventors: Ronald J. Seaman, Keith A. Vanderlee