Patents by Inventor RONALD J. WEACHOCK

RONALD J. WEACHOCK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moisture barrier for a wire bond
    Patent number: 9136245
    Abstract: An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: September 15, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd
    Inventors: John M. DeLucca, Ronald J. Weachock, Barry J. Dutt, Frank A. Baiocchi, John W. Osenbach
  • MOISTURE BARRIER FOR A WIRE BOND
    Publication number: 20140349475
    Abstract: An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad.
    Type: Application
    Filed: May 21, 2014
    Publication date: November 27, 2014
    Applicant: LSI Corporation
    Inventors: John M. DeLucca, Ronald J. Weachock, Barry J. Dutt, Frank A. Baiocchi, John W. Osenbach
  • Moisture barrier for a wire bond
    Patent number: 8766436
    Abstract: An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: July 1, 2014
    Assignee: LSI Corporation
    Inventors: John M. DeLucca, Frank A. Baiocchi, Ronald J. Weachock, John W. Osenbach, Barry J. Dutt
  • MOISTURE BARRIER FOR A WIRE BOND
    Publication number: 20120223432
    Abstract: An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad.
    Type: Application
    Filed: March 1, 2011
    Publication date: September 6, 2012
    Applicant: LSI Corporation
    Inventors: JOHN M. DELUCCA, FRANK A. BAIOCCHI, RONALD J. WEACHOCK, JOHN W. OSENBACH, BARRY J. DUTT