Patents by Inventor Ronald Jack Kuntz

Ronald Jack Kuntz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6302703
    Abstract: A connector for sending power to an IC-chip thru four pressed joints in series includes a solid conductive block having a top surface with a first pair of spaced-apart channels and a bottom surface with a second pair of spaced apart channels. The connector also includes a first springy contact having a center section which touches the top surface of the block in the space between the first pair of channels, and having two ends which are held by the first pair of channels. The connector further includes a second springy contact having a center section which touches the bottom surface of the block in the space between the second pair of channels, and having two ends which are held by the second pair of channels.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: October 16, 2001
    Assignee: Unisys Corporation
    Inventors: Mark DeWayne Bestul, Leonard Harry Alton, Terrence Evan Lewis, Ronald Jack Kuntz, James Dunbar Walker
  • Patent number: 6247939
    Abstract: A connector for making multiple pressed co-axial connections is comprised of an electrically conductive block which has a top surface, a bottom surface, a plurality of signal holes which extend from the top surface to the bottom surface, and a ground terminal. Top and bottom electrically insulative plates are respectively attached to the top and bottom surfaces of the block. Each plate has alignment holes that are aligned with the signal holes; lying in each signal hole is the body of a respective signal contact; and each signal contact has two springy probes which extend from the body thru respective alignment holes in the top and bottom plates. These springy probes are for contacting external signal pads, and they hold the body of each signal contact such that it is surrounded by a uniform air gap in the center of its respective signal hole.
    Type: Grant
    Filed: August 14, 2000
    Date of Patent: June 19, 2001
    Assignee: Unisys Corporation
    Inventors: Mark DeWayne Bestul, Leonard Harry Alton, Terrence Evan Lewis, Ronald Jack Kuntz
  • Patent number: 5724229
    Abstract: A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.
    Type: Grant
    Filed: March 27, 1996
    Date of Patent: March 3, 1998
    Assignee: Unisys Corporation
    Inventors: Jerry Ihor Tustaniwskyi, Leonard Harry Alton, Ronald Jack Kuntz, Ronald Allen Norell